Pressure Sensor Vertical Interconnect Using Side Castellations
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Solution Overview
Problem
Pressure sensor elements face challenges in creating a vertical conductive connection between the sensing bridge and the signal conditioning circuit without utilizing the internal area of the support substrate, which increases fabrication steps and costs.
Innovation Solution
A pressure sensor assembly is designed with a support substrate featuring side castellations and conductive material, connected to a diaphragm substrate via insulating attachment material, forming a conductive path that bridges the gap between the sensing bridge and the signal conditioning circuit, eliminating the need for internal support area usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If internal area of the support substrate is used to connect the sensing bridge to the signal conditioning circuit, then electrical connection is achieved, but fabrication steps increase and cost increases
Solution Approach 1:
The patent transitions from using the internal area (2D plane) of the support substrate to using the side surface (vertical dimension) of the support substrate for creating the conductive connection. This dimensional shift allows electrical connection without occupying internal support area, thereby simplifying fabrication while maintaining connection reliability.
Solution Approach 2:
The conductive connection is segmented into multiple components: side castellations on the support substrate, insulating attachment material, and lateral feed-throughs on the diaphragm substrate. This segmentation allows each component to be optimized independently and simplifies the overall fabrication process.
2Device complexity
If vertical conductive connection is created using internal support area, then electrical communication is established, but device complexity increases
Solution Approach 1:
By moving the conductive connection to the vertical side surface of the support substrate rather than the internal planar area, the patent reduces device complexity while improving ease of manufacture. The side castellations and lateral feed-throughs create a straightforward vertical connection path.
3Ease of manufacture
If conventional internal area connection method is used, then electrical communication is achieved, but manufacturing cost increases
Solution Approach 1:
The patent achieves cost reduction by utilizing the vertical side surface of the support substrate for conductive connections. This approach eliminates the need for complex internal routing and additional fabrication steps, thereby reducing manufacturing cost while maintaining connection functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a cost-effective and efficient vertical conductive connection between the sensing bridge and the signal conditioning circuit, reducing fabrication complexity and costs by avoiding the use of the internal support area.
Implementation Method 1
Conductive joining material bridges across the gap created by thickness of the attachment material to form a conductive connection between bottom end of the side castellations on the support substrate and the lateral feed-through terminations on the diaphragm (second substrate)
Data Source
AI summary
A pressure sensor assembly, which includes a support substrate, circuitry mounted to the support substrate, at least one conductor mounted to the support substrate and in electrical communication with the circuitry, and at least one vertically conductive path connected to and in electrical communication with the at least one conductor. The pressure sensor assembly also includes a diaphragm, at least one sealing glass section connected to the diaphragm and the support substrate, and at least one lateral conductive feed-through mounted to the diaphragm. At least one conductive joint is connected to the vertically conductive path and the lateral conductive feed-through, and the conductive joint provides electrical communication between the vertically conductive path and the lateral conductive feed-through.