Pressure Sensor Solder Joint Spacing for Thermal Crack Resistance

The patent applies preliminary action by pre-forming a solder bump with a non-melting core (such as a ceramic or glass core) before the soldering process. This core structure is prepared in advance to maintain integrity during thermal cycling, preventing the cracking that would occur with conventional thin solder layers. The bump is attached to the component lead in advance, and then the assembly is soldered to the carrier, ensuring the connection remains stable under thermal changes.

The patent employs composite materials by creating a solder bump with a non-melting core (ceramic, glass, or metal) surrounded by a solder material. This composite structure combines the advantages of both materials: the core provides mechanical strength and dimensional stability to prevent cracking, while the solder material provides良好的 wetting and bonding properties for reliable electrical and mechanical connection. This composite bump structure significantly enhances the mechanical stability of the connection compared to thin solder layers alone.

The patent applies beforehand cushioning by incorporating a non-melting core within the solder bump that acts as a cushion or buffer during thermal cycling. This core maintains a controlled gap or space within the solder structure, preventing the solder from completely solidifying and cracking when thermal expansion and contraction forces are applied. The core absorbs the mechanical stress of thermal cycling, cushioning the solder layer against crack formation while still allowing firm attachment of the component.