Pressure Sensor Package With High Modulus Support Member
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Solution Overview
Problem
The existing pressure sensor packages lack a strong carrier platform and effective stress isolation, leading to instability and performance interference from external environmental stress due to the use of thin substrates and plastic sheet members with low Young's modulus.
Innovation Solution
A pressure sensor package design featuring a substrate with a support member made of high Young's modulus resin, mounted via compression molding with a gap and tapered surface, and an encapsulating metal cover to securely hold and isolate the sensor chip from external stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a thin substrate and upper plastic sheet member are used to carry the pressure sensor chip, then the package structure is simple and easy to manufacture, but the package cannot provide a strong carrier platform and cannot effectively resist environmental stress
Solution Approach 1:
The patent employs a composite structure combining a substrate, an upper plastic sheet member, and a support member. The support member is specifically designed with a Young's modulus between 1 GPa and 10 GPa, creating a composite material system that provides enhanced mechanical strength and stress resistance while maintaining manufacturability. This composite approach allows the package to resist environmental stress effectively without excessive complexity in the manufacturing process.
2Device complexity
If a thin substrate and upper plastic sheet member are used to carry the pressure sensor chip, then the package structure is simple, but the package cannot provide a strong carrier platform for the pressure sensor chip
Solution Approach 1:
The patent divides the package structure into distinct functional segments: a substrate for mounting, an upper plastic sheet member for encapsulation, and a dedicated support member for providing mechanical strength. The support member is segmented with a through-hole that exposes the connection port, allowing it to serve both structural and functional purposes. This segmentation allows each component to be optimized independently, maintaining overall simplicity while enhancing the carrier platform strength.
3Device complexity
If the upper plastic sheet member is used to carry the pressure sensor chip, then the package structure is simple, but environmental stress is directly transmitted to the pressure sensor chip to interfere with performance
Solution Approach 1:
The support member acts as an intermediary element between the upper plastic sheet member and the pressure sensor chip. With a Young's modulus between 1 GPa and 10 GPa, it provides mechanical isolation that prevents direct transmission of environmental stress to the sensor chip. The support member's through-hole design allows it to serve as both a structural intermediary and a functional interface, maintaining simplicity while effectively reducing stress interference with the sensor chip performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design provides a stable and strong platform for the sensor chip, effectively reducing external stress interference and enhancing the overall performance of the pressure sensor package by using a high-strength support member and metal encapsulating cover.
Implementation Method 1
the support member enables the pressure sensor package to steadily carry the sensor chip and to isolate stress arising from the external environment
Implementation Method 2
The support member is mounted on the substrate by compression molding
Data Source
AI summary
A pressure sensor package includes a substrate providing a connection port, a support member mounted on the substrate by compression molding and having a gap cut through opposing top and bottom walls thereof to expose the connection port, a sensor chip mounted on the support member and electrically connected to the connection port, an encapsulating cover covered on the support member and defining therein an accommodation chamber that accommodates the sensor chip and a through hole that is disposed in communication with the accommodation chamber for the passing of an external signal therethrough to the sensor chip. Thus, the support member steadily carries the sensor chip and isolates stress arising from the external environment, thereby reducing stress interference with the sensor chip and enhancing the overall performance of the pressure sensor package.