Low-Profile Pressure Sensor Package Using Tape-Based Interconnect
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Solution Overview
Problem
Conventional pressure sensor packages are expensive to manufacture due to the high cost of the pressure sensor cap and substrate, which account for 80 to 90 percent of the overall package cost.
Innovation Solution
A semiconductor package design that eliminates the need for an expensive pressure sensor cap or substrate by using a tape-based attachment method, where a pressure sensor die is encapsulated with an interconnect layer and a gel coat material, allowing for a low-profile, cost-effective package formation with high input/output density and multi-package functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional pressure sensor packages use a pressure sensor cap and substrate, then the package structure is stable and functional, but the manufacturing cost is high (80-90% of overall package cost)
Solution Approach 1:
The patent removes the expensive pressure sensor cap and substrate from the conventional package structure, retaining only the essential pressure sensor die and encapsulation components. This extraction of non-essential but costly elements directly reduces manufacturing cost while maintaining core functionality through alternative support structures.
Solution Approach 2:
The invention changes the structural parameters of the package by eliminating thick substrate and cap layers, transitioning to a thinner profile design. This parameter change in package thickness and structural composition reduces material costs and manufacturing complexity while achieving the desired mechanical support through the encapsulant and bonding pads.
2Length of moving object
If conventional pressure sensor packages use thick substrate and cap, then structural support is adequate, but the package thickness is large
Solution Approach 1:
The patent employs thin film encapsulation and flexible bonding structures to provide adequate structural support without requiring thick substrates. The encapsulant and bonding pads form a supportive matrix that maintains package integrity while enabling a thin-profile design, replacing rigid thick structures with flexible thin-layer alternatives.
Solution Approach 2:
The invention redistributes structural support functions across multiple dimensions by using planar bonding pads and distributed encapsulation rather than relying on vertical thickness. This dimensional redistribution allows the package to achieve adequate structural support through lateral reinforcement and distributed stress management instead of vertical thickness.
3Productivity
If conventional pressure sensor packages use standard substrate design, then manufacturing is straightforward, but input/output density is limited
Solution Approach 1:
The patent segments the package structure into modular components including the pressure sensor die, interconnect layer, encapsulant, and bonding pads, allowing for higher I/O density through optimized component arrangement. This segmentation enables independent optimization of each component for high-density interconnection while maintaining straightforward manufacturing processes for each module.
Solution Approach 2:
The invention creates a universal package structure that can accommodate multiple I/O configurations and sensor types through standardized interconnect layers and bonding pad arrangements. This multi-functional design allows the same basic package structure to support high-density I/O requirements while maintaining ease of manufacture through standardized processes applicable to various configurations.
Data Source
AI summary
A semiconductor package (10) including a pressure sensor die (14) has an interconnect layer (22) formed over a first major surface of the pressure sensor die (14). An encapsulant (18) encapsulates a second major surface and sides of the pressure sensor die (14). A cavity (32) extends through the interconnect layer (22) to the first major surface of the pressure sensor die (14). The interconnect layer (22) allows for the assembly of a low-profile package.