Pressure Sensor Temperature Probe Vibration Damping
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Solution Overview
Problem
Existing pressure sensing devices with integrated temperature sensors face challenges in providing a robust and compact configuration that effectively suppresses vibration and ensures accurate simultaneous measurement of pressure and temperature, particularly in applications like vehicle coolants and engine intake manifolds.
Innovation Solution
A pressure detecting device with a novel configuration featuring a housing with separate chambers, a lead frame, a circuit substrate, a pressure detecting element, and a temperature detecting element, along with a fixing element and conductive wires, which includes a stainless steel tube and brass fixing elements to prevent fluid inflow and enhance coupling, and uses gels for protection and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the temperature sensor is arranged in the pressure inlet hole with lead wires welded on the connector pin, then the temperature sensor can be fixed to the sensor device, but vibration of the temperature sensor occurs due to insufficient vibration suppression
Solution Approach 1:
A buffer member is introduced as an intermediary component between the temperature sensor and the pressure inlet hole. This buffer member receives the temperature sensor and transmits it to the pressure inlet hole, while its elastic deformation absorbs vibration energy, thereby suppressing vibration of the temperature sensor during operation.
Solution Approach 2:
The buffer member is designed with elastic properties to provide beforehand cushioning for the temperature sensor. By positioning the buffer member in advance between the sensor and the mounting structure, vibration and shock are absorbed before they can damage the temperature sensor, ensuring reliable operation in vibratory environments.
2Volume of moving object
If the sensor device is designed with a compact size, then the device becomes more space-efficient, but the temperature sensor cannot be strongly fixed and vibration suppression is insufficient
Solution Approach 1:
The buffer member is designed to be nested within the pressure inlet hole structure, with the temperature sensor nested within the buffer member. This nested arrangement allows the vibration suppression functionality to be integrated into the compact sensor device without significantly increasing its external dimensions.
3Reliability
If the lead wire is made U-shaped and inserted to the pressure inlet hole by applying pressure, then the lead wire can be fixed, but the reaction generated pressurizes the lead wire and temperature sensing element externally causing potential damage
Solution Approach 1:
The buffer member serves as an intermediary that receives and positions the U-shaped lead wire and temperature sensing element. It distributes the insertion pressure uniformly and prevents excessive localized pressure that could damage the lead wire or temperature sensing element, while still achieving reliable fixation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively detects pressure and temperature simultaneously with enhanced robustness and vibration suppression, preventing fluid ingress and ensuring accurate measurements while maintaining a compact size.
Implementation Method 1
a gap between the tube and the housing may be filled with a gel
Implementation Method 2
a temperature detecting element provided inside the tube and transmitting an electrical signal generated according to a temperature change to the circuit substrate
Implementation Method 3
a pressure detecting element provided on a second surface of the circuit substrate and generating an electrical signal according to a pressure change
Data Source
AI summary
Disclosed is a pressure detecting device having a temperature sensor, the device including: a housing having a first chamber, a second chamber, and a port part having a fluid guide tube that guides a pressure transmitting fluid to the second chamber; a lead frame coupled to the housing and configured for being connected to an external device; a circuit substrate electrically connected to the lead frame and including a first surface and a second surface; a pressure detecting element provided on the second surface of the circuit substrate and generating an electrical signal according to a pressure change; a tube coupled to the port part, whereby a first end of the tube is open and provided inside the first chamber; and a temperature detecting element provided inside the tube and transmitting an electrical signal generated according to a temperature change to the circuit substrate.