Pressure Sensor Package Structure for Liquid-Tight Tube Sealing
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Solution Overview
Problem
Existing semiconductor devices that measure pressure face challenges in preventing liquid infiltration due to adhesive protrusion and complex machining requirements, and issues with O-ring support and sealing when a flange portion is included, leading to potential gaps and loose O-ring fit.
Innovation Solution
A semiconductor device design featuring a base substrate with a detector assembly embedded in a resin package, a cylindrical tube with a flange portion overhanging from the outer side surface, and a projecting portion that reduces the gap between the flange and housing, allowing for secure attachment without complex machining and effective sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a flange portion is added to the tube to increase adhesive surface area, then adhesive protrusion is reduced, but the O-ring becomes loose and gaps form between the O-ring and housing
Solution Approach 1:
The tube is divided into two functional portions: a flange portion for adhesive bonding and a cylindrical body portion for O-ring support. This segmentation allows each portion to optimize its specific function without interfering with the other, resolving the contradiction between bonding precision and sealing reliability
Solution Approach 2:
The flange portion extends in the radial direction from the cylindrical body, creating a stepped structure. This dimensional change increases adhesive surface area while maintaining proper O-ring positioning through the vertical offset between the flange and body portions
2Reliability
If the mounting hole diameter is increased to accommodate the flange portion, then O-ring support is improved, but gaps increase between the housing and flange portion
Solution Approach 1:
The mounting hole is conceptually divided into two zones: an upper portion that accommodates the flange portion for O-ring support, and a lower portion that interfaces with the housing for sealing. This segmentation allows the hole to serve dual functions without compromising either O-ring support or sealing precision
Solution Approach 2:
The flange portion is nested within the mounting hole structure, with the O-ring positioned between the flange and housing. This nesting arrangement allows the flange to be supported by the housing through the mounting hole while maintaining proper sealing gaps
3Manufacturing precision
If complex machining is performed to create recessed portions in the adhesive surface, then adhesive protrusion is prevented, but manufacturing complexity increases
Solution Approach 1:
The flange portion is designed with an enlarged adhesive surface area from the beginning, eliminating the need for subsequent recessed portion machining. This preliminary design action prevents adhesive protrusion without requiring complex machining operations
Solution Approach 2:
The complex machining operation to create recessed portions is extracted and replaced by a simple geometric design feature (the flange portion with larger surface area), simplifying the manufacturing process while achieving the same functional result
Data Source
AI summary
A semiconductor device includes a detector assembly mounted on a base substrate and including a detector to detect pressure, a resin package on the base substrate, and a tube supported by the resin package. The resin package includes a base portion on the base substrate and in which the detector assembly is embedded, and a projecting portion including an exposed hole that exposes the detector and projects from the base portion into the tube. The tube includes a tubular body portion and a lower flange portion supported by the base portion. The lower flange portion is inside an outer edge portion of the base portion in plan view. An outer side surface of the projecting portion is bonded to an inner circumferential surface of the tube.