Pressureless Encapsulation of Embedded Electronic Components
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Solution Overview
Problem
There is a need for an efficient and reliable method to embed electronic components within a component carrier for manufacturing electronic packages while minimizing mechanical stress and ensuring reliable electric connections, especially under thermal stress.
Innovation Solution
A method involving the placement of an electronic component on a layer structure, followed by pressureless encapsulation using suitable materials like polyimide or silicone, and forming additional layer structures to create a stack, which can be achieved through printing, coating, additive manufacturing, or dispensing techniques, allowing for the formation of a three-dimensional wiring structure without applying external pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electronic components are embedded within a component carrier using conventional methods, then integration density is increased, but mechanical stress and thermal stress on the electronic component increase
Solution Approach 1:
The patent replaces conventional mechanical embedding methods (which apply pressure and heat) with a chemical deposition process. The encapsulant material is applied in a paste or liquid state and then cured through chemical reactions (UV curing, thermal curing, or moisture curing) rather than mechanical compression, thereby eliminating mechanical stress on the embedded electronic component while achieving secure encapsulation and high integration density
Solution Approach 2:
The patent changes the physical state parameters of the encapsulant material during the process. The material is applied in a soft paste or liquid state at ambient or low temperatures, then transformed into a solid encapsulated structure through chemical curing processes. This parameter change allows embedding without subjecting the electronic component to high mechanical pressure or excessive thermal stress, maintaining reliability while achieving integration
2Productivity
If electronic components are embedded within a component carrier, then high integration density is achieved, but the complexity of ensuring reliable electric connections under thermal stress increases
Solution Approach 1:
The encapsulant material serves multiple functions simultaneously: it provides mechanical support, electrical insulation, environmental protection, and thermal management. This multi-functionality simplifies the overall device structure compared to separate components for each function, reducing the complexity of ensuring reliable electric connections while maintaining high integration density
Solution Approach 2:
The patent uses composite encapsulant materials that combine multiple properties within a single material system. These composite materials provide both mechanical strength for structural support and electrical insulation properties, along with controlled thermal characteristics. This reduces the need for additional separate layers or components, simplifying the device structure while ensuring reliable electric connections under thermal stress
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the easy, reliable, and efficient embedding of electronic components with reduced thermal stress, allowing for high integration density and effective electrical connections, suitable for various electronic components including sensitive and thermo-critical ones.
Implementation Method 1
The provided method comprises (a) placing an electronic component on at least one layer structure; (b) encapsulating the electronic component by an encapsulant (material) in a pressureless way
Implementation Method 2
encapsulating the electronic component by means of at least one of the following procedures: (a) printing, in particular screen printing; (b) coating
Implementation Method 3
encapsulating the electronic component by means of at least one of the following procedures: (a) printing, in particular screen printing; (b) coating; (c) additive manufacturing, in particular three-dimensional printing
Implementation Method 4
encapsulating the electronic component by means of at least one of the following procedures: (a) printing, in particular screen printing; (b) coating; (c) additive manufacturing, in particular three-dimensional printing; (d) dispensing, in particular ink jet dispensing
Implementation Method 5
The uncured encapsulant (material) is covered by a further layer structure. The encapsulant (material) is cured by UV irradiation, by thermal treatment, or by moisture
Implementation Method 6
The encapsulant (material) is cured by UV irradiation, by thermal treatment, or by moisture
Implementation Method 7
The encapsulant (material) is cured by UV irradiation, by thermal treatment, or by moisture
Data Source
AI summary
A method of manufacturing an electronic package is disclosed. The described method includes (a) placing an electronic component on at least one layer structure; (b) encapsulating the electronic component by an encapsulant in a pressureless way; and (c) forming at least one further layer structure at the layer structure to thereby form a stack beneath the encapsulated electronic component. A further described electronic package includes (a) a stack comprising at least one layer structure and at least one further layer structure; (b) an electronic component being placed on the stack; and (c) an encapsulant encapsulating the electronic component, wherein the encapsulant has been formed in a pressureless way. Further described is an electronic device comprising such an electronic package.