Pressureless Conductive Paste Sintering for Electronic Joining

Solution Overview

Problem

Existing sintering technologies for electronic components require high process temperatures and pressures, leading to increased manufacturing time, complexity, and cost, as well as difficulties in controlling fillet thickness.

Innovation Solution

A sintering method using a conductive paste with a metal powder dispersed in an organic vehicle, where the metal powder has a D50 ranging from about 200 nm to about 500 nm, is applied to components without external pressure, allowing for sintering at lower temperatures and pressures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If high process temperatures and pressures are used for sintering, then sintering bond strength is improved, but manufacturing time and complexity increase

Engineering Contradiction:

Improvesintering bond strengthVSAvoidmanufacturing time

Core Design Contradiction:

StrengthVSLoss of time

Solution Approach 1:

The patent changes the particle size parameter of the metal powder to D50 ranging from 200 nm to 500 nm, which fundamentally alters the sintering behavior. This parameter change enables sintering at lower temperatures (reducing manufacturing time) while maintaining adequate bond strength through the enhanced surface area and reactivity of the fine particles.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces the mechanical pressure system with a chemical/thermal sintering mechanism. By using fine metal particles (200-500 nm D50) with high surface energy, the sintering process relies on diffusion and surface energy minimization rather than external mechanical pressure, thereby eliminating the need for complex pressurization equipment and reducing manufacturing time.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Strength

If high process temperatures and pressures are used for sintering, then sintering bond strength is improved, but device complexity increases

Engineering Contradiction:

Improvesintering bond strengthVSAvoiddevice complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical pressure system with a chemical/thermal sintering mechanism. By using fine metal particles (200-500 nm D50) with high surface energy, the sintering process relies on diffusion and surface energy minimization rather than external mechanical pressure, thereby eliminating the need for complex pressurization equipment and reducing manufacturing time.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the particle size parameter of the metal powder to D50 ranging from 200 nm to 500 nm, which fundamentally alters the sintering behavior. This parameter change enables sintering at lower temperatures (reducing manufacturing time) while maintaining adequate bond strength through the enhanced surface area and reactivity of the fine particles.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If no external pressure is applied during sintering, then manufacturing complexity is reduced, but fillet thickness control becomes difficult

Engineering Contradiction:

Improvemanufacturing complexityVSAvoidfillet thickness control

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent changes the particle size parameter of the metal powder to D50 ranging from 200 nm to 500 nm, which fundamentally alters the sintering behavior. This parameter change enables sintering at lower temperatures (reducing manufacturing time) while maintaining adequate bond strength through the enhanced surface area and reactivity of the fine particles.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method reduces manufacturing complexities, decreases sintering times, and eliminates the need for external pressure, resulting in improved processing rates and reduced electrical shorts between sintered components.

Implementation Method 1

drying the conductive paste to form a dried conductive paste

Methodology Applied

Scientific EffectEvaporation: Evaporation

Implementation Method 2

sintering the component arrangement without applying external pressure to the component arrangement

Methodology Applied

Scientific EffectSintering: Sintering

Implementation Method 3

sintering at lower temperatures and pressures

Methodology Applied

Scientific EffectDiffusion: Diffusion

Data Source

PatentUS20250203784A1Sintering Methods

Publication Date: 2025.06.19 MICROMAX (US) HOLDINGS LLC

AI summary

A sintering method for joining at least two components is provided. The method includes disposing a conductive paste on a first component. The conductive paste includes a metal powder dispersed in an organic vehicle. The metal powder has a D50 ranging from about 200 nm to about 500 nm. The method includes drying the conductive paste to form a dried conductive paste and disposing a second component on the dried conductive paste to form a component arrangement. The method includes sintering the component arrangement without applying external pressure to the component arrangement. Electronic articles are also provided.