Test Socket Thermal Head Using Pressurized Fluid Package Retention
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Solution Overview
Problem
Existing semiconductor testing technologies face issues with stress concentrations and hot spots due to stand-offs, leading to die cracking and increased costs from custom manufacturing, while also obstructing fluid flow and thermal parasitic resistance.
Innovation Solution
A thermal head assembly using a pressurized fluid to apply a load to the perimeter and top surface of a semiconductor package, ensuring optimal contact and eliminating the need for stand-offs by using a sealed chamber with a pressurized gas and liquid circulation to manage stress and enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If stand-offs are used to actuate the semiconductor package to the interconnect socket, then the package can be securely positioned, but stress concentrations and hot spots are caused leading to die cracking
Solution Approach 1:
The patent removes the stand-off components from the thermal head assembly, extracting the source of stress concentrations. Instead of using physical stand-offs to position the package, the invention uses a pressurized fluid system that applies uniform pressure through the substrate, eliminating the harmful interface between stand-offs and the die while maintaining positioning stability.
Solution Approach 2:
The patent replaces the mechanical stand-off system with a fluid pressure system. Instead of using solid mechanical components that create point contacts and stress concentrations, the invention uses pressurized fluid (gas or liquid) to apply distributed pressure across the package substrate, substituting mechanical contact with fluid pressure to eliminate stress concentrations.
2Stability of the object's composition
If stand-offs are used in the thermal head, then the package can be actuated to the interconnect socket, but manufacturing costs increase due to high tolerance requirements
Solution Approach 1:
The patent eliminates the stand-off components entirely, removing the need for precision manufacturing of these parts. The fluid pressure system requires no custom-machined stand-off components, thereby reducing manufacturing complexity and cost while maintaining the actuation function through pressure-driven contact.
Solution Approach 2:
The patent replaces the mechanical stand-off actuation system with a fluid pressure system. This substitution eliminates the need for precision-machined mechanical components with tight tolerances, as the fluid pressure system can accommodate variations in component dimensions while maintaining proper contact and actuation.
3Stability of the object's composition
If stand-offs are used to position the package, then contact with the interconnect socket is achieved, but fluid flow is obstructed creating hot spots
Solution Approach 1:
The patent removes the stand-off components that obstruct fluid flow paths. By eliminating these physical barriers between the cooling fluid and the package substrate, the invention enables uniform fluid flow distribution across the entire contact interface, preventing hot spots while maintaining proper electrical and mechanical contact.
Solution Approach 2:
The patent replaces the mechanical stand-off structure with a fluid pressure system that does not obstruct coolant flow. The pressurized fluid applies contact pressure uniformly across the substrate without creating localized flow blockages, allowing cooling fluid to flow freely beneath the package and eliminate hot spots.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method mitigates stress concentrations and die cracking, reduces manufacturing costs, and improves thermal transfer efficiency by eliminating stand-offs and optimizing fluid flow in semiconductor testing.
Implementation Method 1
A force may be applied by the pressurized fluid to the semiconductor package to ensure optimal contact
Implementation Method 2
The liquid may be replaced with a circulating liquid refrigerant to remove the heat generated during the testing
Implementation Method 3
a circulating liquid refrigerant to remove the heat generated during the testing of the semiconductor package
Data Source
AI summary
According to various aspects of the present disclosure, a semiconductor testing equipment may include a thermal head assembly having a body with a recess that is unobstructed and designed to fit over a die on the semiconductor package. A sealing member on the thermal head assembly engages a landing area on the semiconductor package to form a sealed chamber. The semiconductor package may be uniformly loaded by introducing a gas and incrementally increasing the gas pressure in the sealed chamber and increasing mechanical load on the sealing member onto the landing area to prevent leakage. Once the sealed chamber is fully sealed, the combined internal pressure from the circulating gas and a sealing perimeter load enables the proper socketing of the semiconductor package. Thereafter, the gas may be replaced with a circulating liquid refrigerant to remove the heat generated by the die during the testing of the semiconductor package.