Modular Pressurized Workstation for Shorter Semiconductor Cycle Time
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor assembly line processes are inefficient due to manual handling of workpieces between stations, which leads to significant manufacturing overhead and unsatisfactory results, despite using automated tools and ambient air pressure.
Innovation Solution
A modular pressurized workstation with an internal material handling system that maintains consistent atmospheric pressure to automate the transport of semiconductor workpieces between modular tools, reducing manual intervention and integrating tools vertically for efficient processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual handling of semiconductor workpieces is used between stations, then flexibility in moving workpieces is maintained, but manufacturing overhead and processing time increase significantly
Solution Approach 1:
The system divides the semiconductor processing environment into multiple pressurized modules (etching module, deposition module, inspection module, etc.), each maintaining independent controlled pressure environments. This segmentation allows automated robotic transfer between modules while eliminating the need for manual handling in ambient air, thus reducing manufacturing overhead while maintaining automation capability.
Solution Approach 2:
A robotic transfer mechanism serves as an intermediary device that automatically moves semiconductor workpieces between pressurized modules. This intermediary system eliminates the need for manual handling while maintaining continuous automated operation, directly addressing the contradiction between reducing manual handling and improving productivity.
2Loss of time
If tools are spaced apart by significant distances, then each tool has independent operation space, but movement of workpieces between stations consumes significant time and resources
Solution Approach 1:
Multiple processing modules (etching, deposition, inspection, cleaning) are merged into a single integrated pressurized workstation structure. The modules are positioned adjacent to each other within the same pressurized environment, reducing the distance between stations from kilometers/miles to meters, thereby dramatically reducing workpiece transport time while maintaining independent operation capability for each module.
Solution Approach 2:
The system transitions from a horizontal linear arrangement of tools spaced by kilometers to a compact three-dimensional modular configuration where modules are stacked or arranged in close proximity. This dimensional reorganization reduces transport distance while preserving operational independence of each module.
3Device complexity
If ambient air pressure is shared across all stations, then a common environment is maintained, but large amounts of overhead hardware and expensive infrastructure are required
Solution Approach 1:
The atmospheric pressure control system is segmented into independent controlled environments for each pressurized module rather than maintaining a single shared ambient air pressure across all stations. Each module maintains its own controlled pressure environment, eliminating the need for extensive overhead infrastructure while achieving precise pressure control where needed.
Solution Approach 2:
Controlled atmospheric pressure conditions are applied locally to specific processing modules that require them (etching, deposition), while other modules operate in ambient air. This local quality approach reduces overall system complexity by applying pressure control only where necessary rather than system-wide.
Data Source
AI summary
In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.