Pressurizing Members for Semiconductor Package Durability
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Solution Overview
Problem
Current semiconductor packages face challenges in durability due to inadequate pressure applied to semiconductor chips, leading to reduced production yield and increased manufacturing costs, especially when using high-temperature conductive adhesives or expensive materials like silver sintering or copper paste, and existing pressurizing methods do not allow for easy correction of assembly errors or replacement of damaged components.
Innovation Solution
A pressurized semiconductor package design that includes a lead frame with pad boards and first terminals, where semiconductor chips are physically pressurized by multiple pressurizing members without the need for separate adhesives, allowing for easy assembly and disassembly, and a package housing protects the chips, enabling improved durability and simplified manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If pressurizing members pressurize edge areas of metal boards to indirectly pressurize semiconductor chip, then structural connection is achieved, but pressure applied to semiconductor chip is lowered
Solution Approach 1:
The pressurizing member is divided into multiple pressing portions that contact different locations of the semiconductor chip directly. This segmentation allows pressure to be distributed across multiple points on the chip surface, ensuring adequate pressure is applied to the chip itself rather than relying on indirect transmission through metal boards.
Solution Approach 2:
The pressurizing member acts as an intermediary element between the metal boards and the semiconductor chip. It transfers and concentrates the pressing force from the metal boards directly onto the chip through its multiple pressing portions, ensuring efficient force transmission and adequate pressure application to the chip.
2Reliability
If conductive adhesive is used for electrical connection, then electrical connection is achieved, but application is difficult at high temperature due to melting point
Solution Approach 1:
The patent replaces the chemical bonding mechanism of conductive adhesives with a mechanical pressing system. The pressurizing members apply continuous mechanical pressure to maintain electrical contact between the semiconductor chip terminals and the lead frame, eliminating the temperature limitation imposed by adhesive melting points.
Solution Approach 2:
The pressurizing members are designed to automatically maintain adequate contact pressure through their elastic deformation and recovery characteristics. The elastic portions deform under pressing force and then recover, continuously maintaining electrical connection without requiring external control or adjustment mechanisms.
3Reliability
If silver sintering or copper paste is used for electrical connection, then electrical connection is achieved, but manufacturing costs are increased
Solution Approach 1:
The patent employs simple, inexpensive pressurizing members made from basic materials such as elastic bodies and conductive elements. These components are designed to be cost-effective alternatives to expensive materials like silver sintering or copper paste, while still achieving reliable electrical connection through mechanical pressure.
Solution Approach 2:
The pressurizing members utilize the inherent elastic properties of materials to automatically maintain contact pressure. This self-regulating mechanism eliminates the need for complex control systems or expensive materials, achieving reliable electrical connection through simple elastic deformation and recovery.
4Reliability
If semiconductor package is completely assembled for property test, then quality verification is achieved, but individual element replacement is impossible and production yield is lowered
Solution Approach 1:
The pressurizing members are designed as separate, independently replaceable components from the semiconductor chip and lead frame. This segmentation allows individual elements to be accessed and replaced without disassembling the entire package, enabling repair of damaged components while maintaining quality verification capabilities.
Solution Approach 2:
The pressurizing members are designed with dynamic characteristics, including elastic deformation capability and adjustable pressing force. This allows them to accommodate slight variations in component dimensions and enables easy removal and replacement of individual elements without compromising the overall assembly integrity or electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the durability of semiconductor packages by ensuring reliable electrical connections and allowing for easy correction or replacement of components, reducing production costs and improving yield, while enabling operation in high-temperature environments without the limitations of adhesive melting points.
Implementation Method 1
at least one pressurizing member stacked on the semiconductor chip to pressurize the semiconductor chip so as to electrically connect the first terminals to the semiconductor chips
Data Source
AI summary
Provided is a pressurized semiconductor package including a lead frame including a pad board and a first terminal, a semiconductor chip, pressurizing members stacked to pressurize the semiconductor chip, and a package housing. The semiconductor chip is physically pressurized by the pressurizing members and is electrically connected to improve durability of the semiconductor package and to simplify a manufacturing process.