Pre-warped Frame Member for Thermal Warpage Compensation

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Solution Overview

Problem

The use of thermosetting adhesive agents in mounting members with different thermal expansion coefficients can lead to warpage in the frame member, affecting the yield and performance of imaging apparatuses during the manufacturing process.

Innovation Solution

A method involving the interposition of a thermosetting adhesive agent between the base member and the frame member, with the frame member being warped to adjust its thermal expansion coefficient mismatch, and then adhering and cooling them to reduce warpage and improve flatness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a thermosetting adhesive agent is used to bond the frame member and base member with different thermal expansion coefficients, then adhesion strength is improved, but warpage occurs during cooling leading to reduced manufacturing precision

Engineering Contradiction:
Improveadhesion strengthVSAvoidflatness error
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The frame member is pre-warped in the opposite direction of the expected thermal contraction warpage before bonding. This preliminary action counteracts the warpage that will occur during cooling, ensuring the final assembled product maintains proper flatness. The pre-applied stress in the frame member compensates for the differential thermal contraction between the frame member and base member.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention changes the physical state and stress parameters of the frame member by applying controlled deformation during manufacturing. By adjusting the warpage amount and direction as a controllable parameter, the system compensates for thermal expansion coefficient differences. The frame member's initial curved state is deliberately set to achieve a flat final state after thermal cycling.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If the frame member is kept flat during assembly, then ease of manufacture is improved, but warpage occurs after cooling reducing product reliability

Engineering Contradiction:
Improveassembly easeVSAvoidproduct performance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The frame member undergoes preliminary deformation to create a controlled warpage that opposes the expected post-assembly warpage. This allows the assembly process to proceed with a flat appearance while internally preparing the structure to maintain flatness after cooling. The preliminary action embeds compensatory stress into the frame member before final assembly.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention applies an anti-action by pre-warping the frame member in the direction opposite to the expected thermal contraction. This preliminary counter-force ensures that when thermal contraction occurs during cooling, the frame member returns to a flat state rather than warping. The anti-action is built into the structure before the harmful thermal effect occurs.

Inventive Principle:
Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively reduces the flatness error of the frame member, enhancing the manufacturing process and performance of imaging apparatuses by minimizing warpage and ensuring reliable adhesion.

Implementation Method 1

a thermosetting adhesive agent is interposed between the base member and the frame member; adhering the base member and the frame member by heating the base member, the frame member, and the adhesive agent from the state to a temperature equal to or higher than a curing temperature of the adhesive agent

Methodology Applied
Scientific EffectThermosetting adhesive curing: Chemical Bonding

Implementation Method 2

the base member and the frame member having a thermal expansion coefficient different from a thermal expansion coefficient of the base member; the frame member in the state is warped so that a flatness error of the frame member after having been cooled becomes smaller

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS10381314B2Method of manufacturing mounting member and method of manufacturing electronic component
Publication Date: 2019.08.13 CANON KK
  • US10381314B2 patent drawing
  • US10381314B2 patent drawing
  • US10381314B2 patent drawing

AI summary

The method of the invention includes: placing a base member and a frame member having a thermal expansion coefficient different from a thermal expansion coefficient of the base member in a state in which the base member is stacked with the frame member and a thermosetting adhesive agent is interposed between the base member and the frame member; adhering the base member and the frame member by heating the base member, the frame member, and the adhesive agent from the state to a temperature equal to or higher than a curing temperature of the adhesive agent; and cooling the base member and the frame member from the curing temperature. The frame member in the state is warped so that a flatness error of the frame member after having been cooled becomes smaller than that in a case where the frame member is flat in the state.