Primary Cooling Loop Control for Datacenter Thermal Stability

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Datacenter cooling systems face fluctuations in cooling demands due to changing computing loads, leading to overcooling or undercooling issues, particularly in secondary cooling loops, which are not adequately addressed by traditional steady flow rates of primary coolants.

Innovation Solution

Implementing a primary cooling loop control system that adjusts the flow rate of primary coolant based on temperature readings from secondary cooling loops, using sensors and machine learning algorithms to predict heat generation from computing devices and manage coolant flow through flow controllers, CDUs, and heat exchangers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a steady flow rate of primary coolant is used, then the cooling system is simple to operate, but it causes overcooling or undercooling issues in secondary cooling loops due to fluctuating cooling demands

Engineering Contradiction:
Improvecooling system operation simplicityVSAvoidcooling demand fulfillment accuracy
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent applies dynamics by transitioning from a steady flow rate to a variable flow rate that dynamically adjusts in response to fluctuating cooling demands. The primary coolant flow rate is modified based on real-time temperature readings from secondary cooling loops, allowing the system to adapt to changing heat generation levels from computing devices while maintaining operational simplicity through automated control

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent implements feedback control by using temperature readings from sensors in secondary cooling loops to adjust the primary coolant flow rate. This closed-loop feedback mechanism ensures that the cooling system responds to actual thermal conditions, preventing both overcooling and undercooling while maintaining reliable cooling performance across varying workloads

Inventive Principle:
Principle #23Feedback

2Manufacturing precision

If the primary coolant flow rate is adjusted to match fluctuating cooling demands, then cooling precision is improved, but device complexity increases due to additional sensors and control mechanisms

Engineering Contradiction:
Improvecooling temperature control precisionVSAvoidcontrol system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies self-service by enabling the cooling system to automatically adjust its own operation based on real-time temperature conditions. The control system uses temperature readings from secondary cooling loops to autonomously modify primary coolant flow rates without requiring external manual intervention, thereby achieving precise temperature control while managing complexity through automated self-regulation

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent replaces complex manual control mechanisms with automated electronic control systems that use sensors and processing logic to regulate coolant flow. This substitution of mechanical control with electronic and computational methods enables precise temperature control while consolidating complexity into integrated control units rather than multiple separate mechanical components

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Use of energy by moving object

If traditional cooling systems operate with fixed flow rates, then energy consumption is lower, but cooling efficiency decreases under varying heat generation levels from 3 kW to 40 kW

Engineering Contradiction:
Improvecoolant flow energy consumptionVSAvoidcooling efficiency
Core Design Contradiction:
Use of energy by moving objectVSProductivity

Solution Approach 1:

The patent applies parameter changes by varying the primary coolant flow rate parameter in response to changing thermal loads. Instead of maintaining a fixed flow rate, the system adjusts the flow parameter dynamically to match actual heat generation levels, optimizing energy consumption while maintaining high cooling efficiency across the full range of workloads from 3 kW to 40 kW

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces temperature fluctuations in secondary coolants to within 3-5 degrees Celsius, ensuring stable thermal performance and workload stability across varying heat generation levels from 3 kW to 40 kW, enhancing overall cooling efficiency and adaptability.

Implementation Method 1

a heat exchanger that receives heated coolant from the datacenter and that disperses the heat by forced air or other means to the environment

Methodology Applied
Scientific EffectHeat transfer: Heat Exchanger

Implementation Method 2

The cooling systems may include a chiller within the datacenter area, which may include area external to the datacenter itself

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

the cooling tower or other external heat exchanger that receives heated coolant from the datacenter and that disperses the heat by forced air

Methodology Applied
Scientific EffectForced convection: Forced Convection

Data Source

PatentUS20230371212A1Primary cooling loop control to address fluctuation demands on secondary cooling loops for datacenter cooling systems
Publication Date: 2023.11.16 NVIDIA CORP
  • US20230371212A1 patent drawing
  • US20230371212A1 patent drawing
  • US20230371212A1 patent drawing

AI summary

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a primary cooling loop includes at least one primary flow controller to control flow of a primary coolant to a coolant distribution unit (CDU) at a primary flow rate that is determined based in part on heat generated from one or more computing devices that is to be addressed by a secondary coolant, which is to be cooled in a CDU by a primary coolant at a primary flow rate enabled by at least one primary flow controller.