Primer Layer Composition for Universal Substrate Adhesion
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Solution Overview
Problem
Existing photosensitive compositions used in semiconductor and display panel production suffer from insufficient substrate adhesion, particularly with acrylic resin, leading to substrate peeling, which acrylic resin, and acrylic resin, and acrylic resin, and acrylic resin, and acrylic resin, and acrylic resin, due to inadequate adhesion to substrates, especially those without silanol groups on their surfaces.
Innovation Solution
A primer composition containing a photocurable compound with ethylenic unsaturated double bonds, a photopolymerization initiating agent, and a polymerizable compound that forms a covalent bond with the photocurable compound, enhancing adhesion through a primer layer applied to the substrate before the photosensitive composition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a photosensitive composition containing acrylic resin and silane coupling agent is used to improve adhesion, then adhesion to substrates with silanol groups is improved, but the method can only be applied to substrates having silanol groups on their surface and may not provide sufficient effect depending on the amount of silanol group
Solution Approach 1:
The patent introduces a primer composition as an intermediary layer between the substrate and the photosensitive composition. This primer contains a polymerizable compound with multiple functional groups including carboxyl groups that can chemically bond to metal oxide substrates, and hydroxyl groups that can form silane coupling bonds. This intermediary primer layer enables universal adhesion improvement across different substrate types (metal, glass, semiconductor wafers) regardless of their surface chemistry, resolving the limitation of direct silane coupling agent application.
Solution Approach 2:
The invention segments the adhesion improvement function into two distinct components: (1) a primer layer applied first that provides substrate-specific bonding, and (2) a photosensitive composition applied second that provides the functional pattern layer. This segmentation allows each layer to be optimized for its specific bonding interface, with the primer tailored to the substrate and the photosensitive composition tailored to the application requirements.
2Reliability
If acrylic resin is used as the base material in the photosensitive composition, then the composition can be cured by exposure, but adhesion to substrate is not sufficient and peeling may occur
Solution Approach 1:
The primer composition serves as a chemical mediator between the acrylic resin-based photosensitive composition and the substrate. The primer contains polymerizable compounds with multiple functional groups that create strong chemical bonds to the substrate, while the cured photosensitive composition bonds to the primer layer, effectively transferring and distributing adhesion forces across the interface.
Solution Approach 2:
The invention creates a composite adhesion system consisting of the substrate, the primer layer with multiple functional groups, and the cured photosensitive composition layer. This composite structure combines the benefits of chemical bonding (primer to substrate) with the benefits of the photosensitive composition (pattern formation, curing reliability), achieving both strong adhesion and reliable curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The primer composition improves adhesion between the substrate and the cured product layer, regardless of substrate type, by forming a uniform primer layer that enhances the bonding strength and prevents peeling.
Implementation Method 1
a photosensitive composition containing a photocurable compound (a) having an ethylenic unsaturated double bond-containing group, and a photopolymerization initiating agent (b)
Implementation Method 2
the compound (B) having a functional group capable of forming a covalent bond by a reaction with the ethylenic unsaturated double bond-containing group in the photocurable compound (a)
Data Source
AI summary
Provided is a primer composition capable of improving adhesion between a substrate and a cured product layer formed of a cured product of a photosensitive composition regardless of a type of the substrate, a laminate including a primer layer derived from the primer composition, and a method for producing the laminate. The primer composition contains a base material component (A), a compound (B), and a solvent (S), the base material component (A) contains a resin (A1) and/or a polymerizable compound (A2), the polymerizable compound (A2) is a compound polymerizable by a polymerization mechanism other than radical polymerization, and the compound (B) has a functional group capable of forming a covalent bond by a reaction with an ethylenic unsaturated double bond-containing group in a photocurable compound (a) in a photosensitive composition.