Print Component Memory Circuit Segmentation

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Solution Overview

Problem

Existing print components, such as printheads, face challenges due to the limitations of on-die memory in fluidic dies, including high costs, large silicon area consumption, and the risk of defects leading to operational failures when memory elements are defective.

Innovation Solution

A separate memory die is introduced, connected to the fluidic die via I/O terminals, which stores memory values like manufacturing data and thermal behavior, allowing for the replacement or supplementation of defective memory arrays, enabling the print component to remain operational and reducing its size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If on-die memory is used in fluidic dies, then memory capacity is provided, but silicon area consumption increases and cost increases

Engineering Contradiction:
Improvememory capacityVSAvoidsilicon area
Core Design Contradiction:
Quantity of substanceVSArea of stationary object

Solution Approach 1:

The patent divides the memory system into two separate components: a fluidic die containing fluid actuators and a separate memory die containing memory elements. This segmentation allows each die to be optimized independently, reducing the silicon area required on the fluidic die while maintaining necessary memory capacity through the separate memory die that couples to the fluidic die via I/O terminals.

Inventive Principle:
Principle #1Segmentation

2Quantity of substance

If on-die memory is used in fluidic dies, then memory capacity is provided, but manufacturing cost increases

Engineering Contradiction:
Improvememory capacityVSAvoidmanufacturing cost
Core Design Contradiction:
Quantity of substanceVSEase of manufacture

Solution Approach 1:

By segmenting the memory function into a separate memory die, the patent enables independent manufacturing and optimization of each component. The memory die can be manufactured using optimized memory fabrication processes while the fluidic die can be manufactured using optimized fluidic fabrication processes, potentially reducing overall manufacturing cost compared to integrating both functions on a single expensive fluidic die.

Inventive Principle:
Principle #1Segmentation

3Quantity of substance

If on-die memory is used in fluidic dies, then memory is available, but reliability decreases due to defect risk

Engineering Contradiction:
Improvememory availabilityVSAvoidoperational reliability
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent separates the memory function into a distinct memory die that couples to the fluidic die through I/O terminals. This segmentation isolates memory elements from the fluidic actuators, so that a defect in one does not necessarily cause failure of the other. The memory die can be independently tested and replaced without affecting the fluidic die, thereby improving overall system reliability.

Inventive Principle:
Principle #1Segmentation

4Area of stationary object

If separate memory die is used, then silicon area of fluidic die is reduced, but device complexity increases

Engineering Contradiction:
Improvefluidic die sizeVSAvoidsystem complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent merges the fluidic die and memory die into a single integrated print component assembly that couples to the print system through a unified interface. The I/O terminals provide standardized communication between the memory die and fluidic die, managing the complexity internally while presenting a simplified external interface, thereby reducing the fluidic die size without significantly increasing overall system complexity.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11787173B2Print component with memory circuit
Publication Date: 2023.10.17 HEWLETT PACKARD DEVELOPMENT COMPANY LP
  • US11787173B2 patent drawing
  • US11787173B2 patent drawing
  • US11787173B2 patent drawing

AI summary

A memory circuit for a print component including a plurality of I/O pads, including an analog pad, to connect to a plurality of signals paths which communicate operating signals to the print component, and a memory component to store memory values associated with the print component. A control circuit to, in response to identifying a sequence of operating signals representing a memory read, provide a first analog signal on the analog pad in parallel with a second analog signal from the print component to provide an analog electrical value on the analog pad representing stored memory values selected by the memory read.