Print Component Memory Circuit Segmentation
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Solution Overview
Problem
Existing fluidic dies in print components face limitations due to electrical and fluidic operating constraints, which restrict the number of concurrently actuable fluid actuators, and the inclusion of on-die memory consumes significant silicon area and increases dimensions, leading to potential defects and operational issues.
Innovation Solution
A separate memory die is introduced, connected to the fluidic die via I/O terminals, to store memory values such as manufacturing data and thermal behavior, allowing the fluidic die to operate independently and reducing the need for on-die memory, thereby enabling smaller dimensions and supplementary memory capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If on-die memory is included in the fluidic die, then memory capacity is provided, but silicon area increases and dimensions increase
Solution Approach 1:
The memory function is segmented from the fluidic die by implementing a separate memory die that communicates with the fluidic die through I/O terminals. This segmentation allows the fluidic die to focus on fluid actuation functions while the separate memory die provides storage capacity, thereby reducing the silicon area required for the fluidic die itself.
Solution Approach 2:
The memory component is extracted from the fluidic die structure and implemented as a separate die. This extraction removes the memory functionality from the fluidic die's silicon area, enabling the fluidic die to be smaller while still providing necessary memory capacity through the external memory die connection.
2Quantity of substance
If on-die memory is included in the fluidic die, then memory capacity is provided, but device complexity increases
Solution Approach 1:
By segmenting the memory function into a separate die, the complexity of the fluidic die is reduced. The fluidic die only needs to handle fluid actuation and basic I/O communication, while the memory die independently handles storage operations, dividing the overall system complexity into manageable modules.
Solution Approach 2:
Extracting the memory component from the fluidic die simplifies the fluidic die's design and reduces its complexity. The fluidic die can be optimized for its primary fluid actuation function without the additional complexity of integrating memory arrays and control circuitry.
3Quantity of substance
If on-die memory is included in the fluidic die, then memory capacity is provided, but reliability decreases due to potential defects
Solution Approach 1:
Segmenting the memory function into a separate die allows for independent testing and quality control of each component. This segmentation enables better defect detection and isolation, improving overall system reliability by allowing the fluidic die to be manufactured and tested separately from the memory die.
Solution Approach 2:
Extracting the memory component from the fluidic die improves reliability by reducing the total component count on a single die, thereby decreasing the probability of defects. It also enables separate manufacturing processes that can be optimized for each component's specific requirements.
4Adaptability or versatility
If fluid actuators are increased in number, then functionality is improved, but electrical and fluidic operating constraints limit concurrent actuation
Solution Approach 1:
The separate memory die stores configuration data and control sequences that enable complex fluid actuation patterns. By pre-storing actuation sequences and addressing patterns in the external memory, the system can manage and coordinate multiple fluid actuators more effectively, improving concurrent actuation capability.
Solution Approach 2:
The separate memory die acts as an intermediary that offloads the complexity of managing multiple fluid actuators. It stores addressing information, actuation sequences, and control parameters, allowing the fluidic die to access this information through I/O terminals without the complexity being integrated into the fluidic die itself.
Data Source
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AI summary
A memory circuit for a print component including a plurality of I/O pads, including an analog pad, to connect to a plurality of signals paths which communicate operating signals to the print component, and a memory component to store memory values associated with the print component. A control circuit to, in response to identifying a sequence of operating signals representing a memory read, provide a first analog signal on the analog pad in parallel with a second analog signal from the print component to provide an analog electrical value on the analog pad representing stored memory values selected by the memory read.