Print Head Flexible Wiring Substrate High Density
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Solution Overview
Problem
High-density print heads with piezoelectric elements face challenges in supplying drive signals efficiently due to the increased number of nozzles, leading to issues with wiring density, signal accuracy, and resistance variations, which affect printing precision and reliability.
Innovation Solution
A print head design incorporating a multilayer flexible wiring substrate with conductive metal and nonconductive resin, laminated without adhesive, to reduce reaction forces and maintain shape accuracy, allowing for higher nozzle density and improved signal waveform accuracy, while also ensuring good high-frequency characteristics and resistance uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of nozzles is increased to achieve high-density printing, then the printing resolution is improved, but the wiring density becomes excessively high making assembly difficult
Solution Approach 1:
The patent transitions from planar wiring to three-dimensional wiring by bending the flexible wiring substrate. This allows wiring to extend in multiple spatial dimensions rather than being constrained to a flat plane, effectively reducing wiring density and simplifying assembly while maintaining support for high-density nozzle arrangements.
Solution Approach 2:
The patent employs a flexible wiring substrate that can be bent into three-dimensional configurations. This flexibility enables the wiring to adapt to the spatial requirements of high-density nozzle arrangements without requiring excessively dense planar wiring, thereby reducing assembly complexity.
2Ease of manufacture
If adhesive is used to laminate the flexible wiring substrate, then the substrate can be assembled, but the adhesive deteriorates due to liquid ejection influence
Solution Approach 1:
The patent removes the adhesive layer from the flexible wiring substrate structure. By eliminating the adhesive, the source of deterioration from liquid ejection influence is removed, thereby improving reliability while maintaining manufacturability through alternative bonding methods.
3Strength
If the flexible wiring substrate is made thicker to improve structural stability, then the substrate is more durable, but the reaction force during bending increases making high-precision assembly difficult
Solution Approach 1:
The patent utilizes the dynamic flexibility of a thin, bendable substrate that can be positioned and fixed in a three-dimensional configuration. The substrate's flexibility allows for precise positioning during assembly, and once assembled, the structure maintains its shape and stability without requiring excessive thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design facilitates high-density nozzle arrangements with enhanced signal accuracy and reliability, enabling precise and high-precision printing by reducing wiring resistance variations and maintaining signal integrity across the print head.
Implementation Method 1
a drive module having 600 or more piezoelectric elements aligned at a density of 300 or more per inch for ejecting liquid
Implementation Method 2
the flexible wiring substrate be a multilayer substrate in which the nonconductive resin is pressure bonded by heat
Data Source
AI summary
A print head includes a first substrate having 600 or more piezoelectric elements aligned at a density of 300 or more per inch for ejecting liquid, a second substrate, and a flexible wiring substrate that connects the first substrate and the second substrate, in which the flexible wiring substrate is a multilayer substrate in which a conductive metal and a nonconductive resin are laminated and the nonconductive resin is pressure bonded.