Print Head Integrated Circuit Positioning for Ink Mist Detection
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Solution Overview
Problem
Liquid mist entering a liquid ejecting apparatus, such as an ink jet printer, can cause short-circuits and malfunctions due to its attraction to conductive components, and existing detection methods lack accuracy in identifying abnormalities within the print head.
Innovation Solution
A liquid ejecting apparatus with a print head, digital signal output circuit, and liquid accommodating container, where the integrated circuit for abnormality detection is positioned on a different surface from the connector and capacitors, allowing for improved detection of ink mist adherence and reducing the risk of malfunctions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the integrated circuit is positioned on the same surface as the connector and capacitor, then the device structure is simplified, but the detection accuracy of liquid mist adherence is reduced
Solution Approach 1:
The patent transitions from a planar arrangement (all components on the same surface) to a three-dimensional arrangement by positioning the integrated circuit on a different surface of the substrate. This spatial dimensionality change allows the integrated circuit to be physically separated from the connector and capacitor, enabling more accurate detection of liquid mist adherence without interference from these components.
2Measurement precision
If the integrated circuit is positioned away from the connector and capacitor on a different surface, then the detection accuracy is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent segments the substrate into different surfaces (first surface and second surface) and assigns different components to each surface. The connector and capacitor are positioned on one surface while the integrated circuit is positioned on the opposite surface. This segmentation approach simplifies the manufacturing process by allowing independent fabrication and assembly of components on separate surfaces, reducing interference during assembly.
3Ease of operation
If the integrated circuit is on the same surface as connector and capacitor, then assembly is simplified, but the risk of liquid mist adhering to the integrated circuit increases
Solution Approach 1:
The patent extracts the integrated circuit from the same surface as the connector and capacitor by positioning it on the opposite surface of the substrate. This extraction physically separates the integrated circuit from the environment where liquid mist accumulates, reducing the risk of liquid mist adherence while maintaining reliable electrical connections through the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the accuracy of abnormality detection and reduces the likelihood of ink mist adhering to the integrated circuit, thereby minimizing the occurrence of malfunctions and improving the reliability of the print head.
Implementation Method 1
a capacitor electrically coupled to the integrated circuit, the connector and the capacitor are provided on the first surface
Data Source
AI summary
A liquid ejecting apparatus includes a print head, a digital signal output circuit, and a liquid accommodating container, in which the print head includes a supply port to which the liquid is supplied from the liquid accommodating container, a nozzle plate having a plurality of nozzles that eject the liquid, a substrate that has a first surface and a second surface different from the first surface, a connector to which the digital signal is input, an integrated circuit to which the digital signal is input via the connector and that outputs an abnormality detection signal indicating presence or absence of an abnormality in the print head, and a first capacitor electrically coupled to the integrated circuit, the connector and the first capacitor are provided on the first surface, and the integrated circuit is provided on the second surface.