Print Head Interposer for Flat Surface and Silicon Reduction
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Solution Overview
Problem
Current ink jet printer configurations require additional silicon for external interconnects, leading to increased costs and uneven print head surfaces due to protruding wire bonds from externally coupled ASICs or drive ICs.
Innovation Solution
Integration of an interposer within the molded print head allows internal wire bonding of the drive IC to the print head die, eliminating the need for external silicon pads and interconnects, and encapsulating the wire bonds to create a flat surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external interconnects are used to couple ASICs or drive ICs to the molded print head, then electrical connections can be established, but additional silicon is required and the surface becomes uneven due to protruding wire bonds
Solution Approach 1:
The patent merges the drive IC, interposer, and wire bonds into a single integrated assembly that is completely encapsulated within the molded compound. This integration eliminates the need for external interconnects and protruding wire bonds, achieving both reliable electrical connection and a flat print head surface.
Solution Approach 2:
The patent employs a nested structure where the drive IC and interposer are positioned within the molded print head, with wire bonds nested between them. The entire assembly is then encapsulated by the molded compound, creating a compact, flat-integrated unit that eliminates external protrusions.
2Reliability
If external interconnects with additional silicon pads are used, then electrical connections can be established, but silicon consumption increases leading to higher costs
Solution Approach 1:
The patent extracts the interconnect function from external silicon pads and relocates it to an interposer structure that is integrated within the molded print head. This extraction eliminates the need for additional silicon pads on the print head die, reducing silicon consumption while maintaining electrical connection capability.
Solution Approach 2:
The patent introduces an interposer as an intermediary component between the print head die and drive IC. This interposer provides the necessary electrical interconnects without requiring additional silicon pads on the print head, thereby reducing silicon consumption while enabling reliable electrical connections.
3Reliability
If ASICs or drive ICs are coupled externally to the molded print head, then electrical connections can be established, but the print head surface becomes uneven
Solution Approach 1:
The patent merges all electrical connection components (drive IC, interposer, wire bonds) into a single integrated assembly that is completely encapsulated within the molded print head. This integration creates a flat surface that simplifies manufacturing processes and improves manufacturing efficiency.
4Reliability
If wire bonds are used to connect external ICs, then electrical connections can be established, but protruding wire bonds create an uneven surface
Solution Approach 1:
The patent positions the wire bonds within the internal volume of the molded print head, nesting them between the print head die and drive IC. This nesting, combined with complete encapsulation by the molded compound, eliminates protruding wire bonds and creates a flat surface while maintaining electrical connection reliability.
Data Source
AI summary
In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.