Print Head Substrate Layout for Compact Multi-Color Wiring
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Solution Overview
Problem
The existing print heads in serial type printing apparatuses become oversized due to the arrangement of multiple print element substrates in parallel, leading to increased wiring complexity and size, especially when multiple ejection port rows are integrated into a single print element substrate.
Innovation Solution
The print head design includes a configuration where first and second print element substrates are arranged in parallel with their terminal rows located on the outer sides and ejection element rows on the inner sides, with connection substrates electrically connecting them, minimizing the overall width and reducing the need for extensive wiring between substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple print element substrates are arranged in parallel to increase the number of ink colors, then the functionality is improved, but the print head size increases due to wiring complexity
Solution Approach 1:
The patent transitions from arranging print element substrates side-by-side in the same plane to stacking them in multiple layers along the thickness direction. This dimensional change allows multiple substrates (supporting different ink colors) to be integrated without increasing the planar footprint of the print head, thus resolving the contradiction between functionality and size.
Solution Approach 2:
The patent implements a layered structure where multiple print element substrates are nested along the thickness direction, with each substrate containing ejection port rows for different ink colors. This nesting approach allows multiple functional layers to be compactly integrated, enabling support for multiple ink colors while maintaining a compact print head size.
2Device complexity
If multiple ejection port rows are integrated into one print element substrate, then the device complexity is reduced, but wiring complexity increases causing the print head to upsize
Solution Approach 1:
The patent resolves the wiring complexity issue by moving substrate arrangements into the thickness direction, creating multiple layers. This vertical stacking reduces the need for extensive lateral wiring connections between substrates, as each layer can be independently connected through vertical interlayer connections, thus preventing print head upsize while maintaining low device complexity.
3Adaptability or versatility
If print element substrates are arranged in parallel, then the number of ink colors is increased, but wiring complexity increases
Solution Approach 1:
The patent eliminates wiring complexity by arranging print element substrates in the thickness direction rather than parallel in the same plane. This vertical stacking allows each substrate to be connected through simplified interlayer wiring paths, reducing overall wiring complexity while still enabling support for multiple ink colors through the layered architecture.
Solution Approach 2:
The nested layered structure allows multiple substrates supporting different ink colors to be compactly integrated along the thickness direction. This nesting reduces the need for complex lateral wiring by enabling vertical connection paths, thus achieving multi-color functionality with reduced wiring complexity.
Data Source
AI summary
In a downsized print head, in which a plurality of print element substrates are arranged in parallel in a serial type printing apparatus, a first print element substrate, in which a terminal row and an ejection element row are arranged, and a second print element substrate, in which a terminal row and an ejection element row are arranged, are arranged in parallel. The first print element substrate and the second print element substrate are arranged so that each terminal row is located outside in a first direction and each ejection element row is located inside in the first direction.