Print Head Element Substrate Wiring Layer Merging
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Solution Overview
Problem
The increasing number of heating elements on print heads requires optimized wiring arrangements on element substrates, but existing configurations face issues with interlayer short circuits and increased costs due to large areas of facing power supply wiring lines, leading to yield decreases and higher manufacturing costs.
Innovation Solution
The element substrate features overlapping electrical wiring layers with parallel wiring groups of different thicknesses, where VH and GNDH wiring lines are routed in the same layer, intersecting and connected via through-hole wiring lines to reduce interlayer short circuits and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If different power supply wiring lines (VH wiring line and GNDH wiring line) are provided in separate layers facing each other, then wiring connectivity is achieved, but interlayer short circuits caused by foreign matter increase and yield decreases
Solution Approach 1:
The patent merges the VH wiring line and GNDH wiring line into the same wiring layer instead of separate layers. This eliminates the large area of facing wiring lines between layers, thereby reducing the risk of interlayer short circuits caused by foreign matter during manufacturing while maintaining electrical connectivity functionality.
2Reliability
If separate wiring layers are used for VH and GNDH wiring lines, then wiring isolation is achieved, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple wiring lines (VH and GNDH) into a single wiring layer, reducing the total number of wiring layers from two to one. This simplification decreases manufacturing complexity and cost while maintaining necessary wiring isolation through spatial arrangement within the same layer.
3Productivity
If the number of heating elements is increased to improve print speed and image quality, then printing performance is improved, but element substrate area increases and wiring arrangement becomes more complex
Solution Approach 1:
The patent merges multiple wiring lines into the same layer with parallel arrangements, which simplifies the wiring pattern design and reduces arrangement complexity. This allows for efficient wiring of a larger number of heating elements without proportionally increasing wiring complexity, as the parallel wiring structure provides a systematic and scalable approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces yield loss and manufacturing costs by minimizing interlayer short circuits and optimizing wiring resistance, allowing for higher print quality and increased ejection port density while maintaining efficient heat transfer and foaming stability.
Implementation Method 1
an electrical wiring line configured to supply the heating elements with power, the electrical wiring line being provided in a first electrical wiring layer and a second electrical wiring layer overlapping the first electrical wiring layer
Data Source
AI summary
According to the present invention, it is possible to provide an element substrate and a print head with which a decrease in yield and an increase in cost in a manufacturing process can be suppressed. For that purpose, a VH wiring line and a GNDH wiring line are provided in parallel in the same layer.