Print Component Logic Circuitry for Pressurization Sensing

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Solution Overview

Problem

Existing printing systems face challenges in efficiently communicating and managing data between replaceable print apparatus components and the host print apparatus, particularly in verifying pressurization and material level sensing, which affects the reliability and accuracy of printing processes.

Innovation Solution

The implementation of a logic circuitry package with a sensor cell array that uses strain gauges to detect reservoir deflection and communicate via I2C protocol, enabling effective data exchange and validation of pressurization events, and alternative digital solutions that emulate analog sensor outputs for simpler and more reliable operations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If strain gauge sensors are used to detect reservoir deflection for pressurization verification, then measurement precision is improved, but device complexity increases

Engineering Contradiction:
Improvepressurization detection accuracyVSAvoidsensor array complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The sensor system is divided into multiple discrete strain gauge cells arranged in an array across the reservoir surface. Each sensor cell independently measures local deflection, allowing the system to achieve high measurement precision through distributed sensing while managing complexity through modular sensor units that can be individually addressed and calibrated.

Inventive Principle:
Principle #1Segmentation

2Reliability

If I2C communication protocol is implemented for data exchange between logic circuitry and print apparatus, then communication reliability is improved, but device complexity increases

Engineering Contradiction:
Improvecommunication reliabilityVSAvoidcommunication interface complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The logic circuitry package incorporates a standard I2C communication interface that enables reliable data exchange between the sensor array and the print apparatus controller. The I2C protocol provides robust error handling and acknowledgment mechanisms for improved reliability, while the logic circuitry integrates multiple functions (sensor readout, data processing, communication) into a single package to manage overall device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of operation

If digital emulation of analog sensor outputs is implemented, then ease of operation is improved, but measurement precision may be reduced

Engineering Contradiction:
Improvesensor interface simplicityVSAvoidsensor output accuracy
Core Design Contradiction:
Ease of operationVSMeasurement precision

Solution Approach 1:

The system replaces complex analog signal conditioning and processing with digital emulation of sensor outputs. The logic circuitry digitally simulates the expected analog sensor behavior, providing simplified interfaces for the print apparatus controller while maintaining operational accuracy through precise digital modeling of the physical sensor characteristics and response patterns.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the reliability and accuracy of printing by ensuring proper pressurization and material flow, reducing the risk of leakage and improving compatibility between print apparatus and components, while also offering cost-effective and robust communication methods.

Implementation Method 1

uses strain gauges to detect reservoir deflection

Methodology Applied
Scientific EffectStrain gauge measurement: Piezoresistive Effect

Data Source

PatentUS11312146B2Logic circuitry package
Publication Date: 2022.04.26 HEWLETT PACKARD DEVELOPMENT COMPANY LP
  • US11312146B2 patent drawing
  • US11312146B2 patent drawing
  • US11312146B2 patent drawing

AI summary

A logic circuitry package for a replaceable print apparatus component includes an interface to communicate with a print apparatus logic circuit, and at least one logic circuit to receive, via the interface, requests corresponding to different sensor IDs with the component connected to the apparatus. The logic circuit is to transmit, via the interface, a digital value in response to each request. The digital values corresponding to the different sensor IDs are distinct.