Print Component Logic Circuitry for Accurate Temperature Sensing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current print apparatus systems face challenges in efficiently communicating and managing data between replaceable print components and the print apparatus, particularly in ensuring accurate temperature readings and material level sensing, due to limitations in communication protocols and resource constraints of replaceable components.
Innovation Solution
The implementation of a logic circuitry package with a processor and memory, capable of communicating via I2C protocol, which includes multiple addresses for different functions, allowing secure and reconfigurable communication for data processing and sensor operations, enabling effective temperature calculation and material level monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple communication protocols are supported in replaceable print components, then communication versatility is improved, but device complexity and resource requirements increase
Solution Approach 1:
The communication functionality is segmented into a separate logic circuitry package that can be independently configured. This package contains the communication interface and protocol handling logic, separating it from the main print component circuitry. This allows the main component to remain simple while the communication package provides versatile protocol support through software configuration rather than hardware complexity.
Solution Approach 2:
The logic circuitry package is designed with universal communication capabilities that can be configured to support multiple protocols (I2C, SPI, UART, etc.) through software settings rather than dedicated hardware for each protocol. This multi-functional approach allows a single package design to serve multiple communication needs without increasing hardware complexity.
2Reliability
If secure communication is implemented in replaceable components, then communication reliability is improved, but processing overhead and complexity increase
Solution Approach 1:
Security credentials and communication parameters are pre-configured in the logic circuitry package during manufacturing or initial setup. Authentication keys, device IDs, and protocol parameters are stored in advance, eliminating the need for complex runtime security negotiations. This preliminary configuration reduces processing overhead during actual communication operations while maintaining secure reliability.
3Adaptability or versatility
If reconfigurable communication addresses are implemented, then adaptability is improved, but communication protocol overhead increases
Solution Approach 1:
The communication address configuration is made dynamic through software control rather than fixed hardware addressing. The logic circuitry package can dynamically change its I2C address or other communication identifiers based on operational mode, device state, or external configuration commands. This dynamic reconfigurability allows adaptability without requiring complex address negotiation protocols, reducing communication overhead.
Data Source
AI summary
A logic circuitry package for a replaceable print apparatus component includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit. The at least one logic circuit includes a memory storing at least one temperature calculation parameter. The at least one logic circuit is configured to receive, via the interface, a first request to read the at least one temperature calculation parameter; and transmit, via the interface, the at least one temperature calculation parameter in response to the first request. The at least one logic circuit is configured to receive, via the interface, a second request corresponding to a sensor ID; and transmit, via the interface, a digital value in response to the second request. The digital value adjusted based on the at least one temperature calculation parameter corresponds to an absolute temperature of the print apparatus component.