Printable Circuit Testing via Breakable Tethers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Testing small, active circuit elements on wafers is challenging due to their size and the difficulty in incorporating external test probes or additional test circuitry, making it hard to assess functionality before they are transferred to a destination substrate.
Innovation Solution
The use of electrically conductive breakable tethers that suspend active components over a substrate, allowing for electrical connectivity and testing while maintaining the components' structural integrity until they are transferred.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If small active components are separated from the wafer to be transferred, then the components can be transferred to destination substrates, but it becomes difficult to test functionality before transfer
Solution Approach 1:
The patent performs testing actions before the component separation and transfer. Test circuitry is integrated onto the wafer substrate, allowing functionality verification of active components while they remain attached to the wafer, before they are separated and transferred to destination substrates.
Solution Approach 2:
The patent introduces an intermediary testing system comprising test circuitry integrated on the wafer substrate. This intermediary system provides the measurement and detection functions needed to test active components, bridging the gap between component fabrication and transfer operations.
2Difficulty of detecting and measuring
If additional test circuitry is added to small active components, then functionality can be tested, but the components become too complex and difficult to manufacture
Solution Approach 1:
The patent merges the test circuitry with the wafer substrate itself, rather than adding separate test circuits to each small active component. This consolidation allows testing functionality to be achieved while keeping individual component designs simple and manufacturing processes straightforward.
Solution Approach 2:
The wafer substrate is designed to serve multiple functions: it acts as both the fabrication platform and the testing platform. The integrated test circuitry on the wafer can test multiple active components simultaneously, providing universal testing capability without adding complexity to individual components.
3Difficulty of detecting and measuring
If external test probes are used on small active components, then electrical testing can be performed, but the probes are too large relative to the component size
Solution Approach 1:
The patent transitions from external three-dimensional probe contact to integrated two-dimensional circuit board trace connections for testing. Test signals are routed through conductive traces on the wafer substrate plane, eliminating the need for external probes that would be too large relative to small active component dimensions.
Solution Approach 2:
The wafer substrate with its integrated test circuitry serves as an intermediary that provides electrical access to active components without requiring direct external probe contact. The test circuitry mediates between external test equipment and the small active components, enabling electrical testing through scaled-appropriate connection methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective testing of small active components before transfer, ensuring functionality and reducing the risk of defective components being printed on a destination substrate.
Implementation Method 1
electrically conductive breakable tethers that suspend active components over a substrate, allowing for electrical connectivity and testing
Data Source
AI summary
A substrate includes an anchor area physically secured to a surface of the substrate and at least one printable electronic component. The at least one printable electronic component includes an active layer having one or more active elements thereon, and is suspended over the surface of the substrate by electrically conductive breakable tethers. The electrically conductive breakable tethers include an insulating layer and a conductive layer thereon that physically secure and electrically connect the at least one printable electronic component to the anchor area, and are configured to be preferentially fractured responsive to pressure applied thereto. Related methods of fabrication and testing are also discussed.