Printable Diode Ink for Low-Cost LED Manufacturing
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Solution Overview
Problem
Current methods for manufacturing light emitting and photovoltaic devices are costly and labor-intensive, as they require complex processes involving semiconductor wafers and assembly, making them expensive for widespread consumer use.
Innovation Solution
Development of a 'diode ink' comprising a liquid or gel suspension of fully formed, functioning two-terminal integrated circuits that can be printed using screen printing or flexographic printing, allowing for the creation of LED-based devices and photovoltaic panels with reduced component and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional semiconductor wafer manufacturing methods are used, then device reliability and performance are improved, but manufacturing cost and labor intensity increase significantly
Solution Approach 1:
The invention segments the manufacturing process by separating diode fabrication from final device assembly. Pre-formed diodes are produced independently on semiconductor wafers, then dispersed in a liquid or gel suspension medium that allows them to be transported and applied as a printable composition, eliminating complex assembly operations
Solution Approach 2:
A liquid or gel suspension medium serves as an intermediary carrier that holds pre-formed diodes and enables their transfer to final device substrates. This intermediary composition simplifies the manufacturing process by replacing direct wafer-level assembly with a printable application process
2Reliability
If complex assembly processes are used, then device performance is improved, but manufacturing time and labor requirements increase
Solution Approach 1:
Diodes are pre-formed and tested on semiconductor wafers before being dispersed in the liquid or gel suspension. This preliminary fabrication and characterization eliminates the need for complex assembly operations during final device manufacturing, as diodes are already ready-for-use components
Solution Approach 2:
The invention replaces mechanical assembly operations with a printable application process. The liquid or gel suspension containing pre-formed diodes can be deposited using printing techniques, substituting labor-intensive manual or automated assembly with a more efficient deposition process
3Manufacturing precision
If traditional manufacturing methods are used, then device quality is improved, but scalability and cost-effectiveness for consumer applications deteriorate
Solution Approach 1:
The liquid or gel suspension composition serves multiple functions: it acts as a carrier for pre-formed diodes, a printable medium for device fabrication, and a potential functional matrix that maintains diode positioning and electrical connections. This multi-functionality enables scalable production across different device types and configurations
Solution Approach 2:
The invention changes the physical state and delivery parameters of diodes from rigid wafer-mounted components to suspended particles in a liquid or gel medium. This parameter change enables new fabrication approaches including printing techniques, allowing scalable production while maintaining diode quality through controlled suspension and deposition processes
Data Source
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AI summary
A exemplary diode (100) having a light emitting or absorbing region (185) having a diameter between about 20 to 30 microns an a height between 2.5 to 7 microns; a plurality of first terminals (127, 128) spaced apart and coupled to the light emitting or absorbing region peripherally on a first side, each of these terminals having a height of 0.5 to 2 microns and a second central terminal (120B, 125) coupled to a mesa region of the light emitting or absorbing region on the first side, the second terminal having a height of 1 to 8 microns.