Printable Diode Ink for Low-Cost LED Manufacturing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for manufacturing light emitting diodes (LEDs) and photovoltaic devices are costly and labor-intensive, involving complex processes that make them unsuitable for widespread consumer use, as they require semiconductor wafers and intricate assembly processes.
Innovation Solution
A liquid or gel suspension of fully formed, functioning diodes or two-terminal integrated circuits is developed, allowing for printing-based manufacturing using a diode ink composition that includes diodes, solvents, and viscosity modifiers, enabling the creation of LED-based devices and photovoltaic panels through screen or flexographic printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional semiconductor wafer processes are used to manufacture LEDs, then device performance and reliability are improved, but manufacturing cost and complexity increase significantly
Solution Approach 1:
The patent segments the manufacturing process by separating diode fabrication from final device assembly. Fully formed diodes are manufactured independently using conventional processes, then suspended in an ink vehicle to create a printable composition. This segmentation allows complex diodes to be produced reliably while simplifying the overall manufacturing process through printing-based assembly.
Solution Approach 2:
The patent introduces an intermediary medium—an ink vehicle containing suspended diodes, solvents, and viscosity modifiers—that bridges the gap between traditional semiconductor manufacturing and final device assembly. This intermediary allows diodes to be transported and deposited in a controlled manner, reducing the complexity of direct wafer-to-device processes.
2Manufacturing precision
If conventional LED manufacturing processes are used, then product quality is maintained, but production cost and labor intensity increase
Solution Approach 1:
The patent replaces complex mechanical assembly processes with a printing-based system. Instead of manually or mechanically assembling individual diodes into devices, the invention uses printing technology to deposit diodes from a suspended composition, significantly simplifying the manufacturing process while maintaining product quality through controlled deposition.
Solution Approach 2:
The patent changes the physical state and parameters of diode delivery by suspending fully formed diodes in a liquid or gel ink vehicle with specific viscosity characteristics. This parameter change enables diodes to be processed as a flowing composition rather than discrete components, improving ease of manufacture while maintaining diode integrity and quality.
3Device complexity
If printing processes are used to manufacture LED devices, then production cost and complexity are reduced, but traditional semiconductor processes must be adapted
Solution Approach 1:
The patent performs preliminary action by completely forming diodes using conventional semiconductor processes before suspension in the ink vehicle. This preliminary fabrication ensures diodes meet performance specifications, while the subsequent printing step adapts to various device configurations, achieving both simplicity and adaptability.
Solution Approach 2:
The patent creates a universal printable composition that can be used to manufacture various LED-based devices and photovoltaic panels. The same diode suspension technology can be adapted to different substrates, device architectures, and applications, providing versatility while maintaining a simplified core manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and simplifies the manufacturing process, making LED-based devices and photovoltaic panels more affordable and accessible for consumer and business use by leveraging a printing process that suspends and disperses diodes in a solvent or gel medium, allowing for the creation of functional devices in a non-inert atmosphere.
Implementation Method 1
a plurality of light emitting diodes distributed substantially randomly and in parallel on a first conductor of the plurality of first conductors, at least some of the plurality of light emitting diodes having a first, forward-bias orientation
Implementation Method 2
at least one of the plurality of light emitting diodes having a second, reverse-bias orientation
Data Source
AI summary
An exemplary printable composition of a liquid or gel suspension of diodes generally includes a plurality of diodes, a first solvent and/or a viscosity modifier. An exemplary apparatus may include: a plurality of diodes; at least a trace amount of a first solvent; and a polymeric or resin film at least partially surrounding each diode of the plurality of diodes. Various exemplary diodes have a lateral dimension between about 10 to 50 microns and about 5 to 25 microns in height. Other embodiments may also include a plurality of substantially chemically inert particles having a range of sizes between about 10 to about 50 microns.


