Printable Diode Ink for Low-Cost LED Manufacturing
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Solution Overview
Problem
Current methods for manufacturing light emitting diodes (LEDs) and photovoltaic devices are costly and labor-intensive, making them unsuitable for widespread consumer use due to the complexity and expense of semiconductor wafer processing and assembly.
Innovation Solution
A liquid or gel suspension of fully formed, functioning diodes or two-terminal integrated circuits is developed, allowing for printing of LED-based devices and photovoltaic panels using a printable 'diode ink' composed of diodes suspended in a solvent and viscous resin, enabling less expensive and more robust manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional semiconductor wafer processing and assembly methods are used, then manufacturing precision and reliability are improved, but manufacturing cost and time increase significantly
Solution Approach 1:
The invention segments the diode manufacturing process by pre-fabricating individual diodes on separate carriers using traditional high-precision methods, then suspending them in a liquid or gel medium for printing. This separates the precision manufacturing step from the low-cost assembly step, allowing high reliability diodes to be produced through a simplified, cost-effective printing process.
Solution Approach 2:
The invention performs preliminary actions by pre-fabricating fully formed, functioning diodes on carriers before suspension in the liquid/gel medium. These pre-prepared diodes are then ready for direct printing application, eliminating the need for complex real-time assembly operations and reducing manufacturing complexity.
2Reliability
If traditional LED assembly methods are used, then device performance is improved, but manufacturing time and labor intensity increase
Solution Approach 1:
The invention uses liquid or gel hydrodynamics to suspend and transport diodes, enabling printing-based assembly instead of mechanical handling. This fluid-based approach automates the assembly process, dramatically increasing productivity while maintaining device performance through proper diode orientation and placement.
Solution Approach 2:
The invention changes the physical state of the assembly medium from solid/liquid adhesives to a suspended liquid or gel containing entire diodes. This parameter change enables direct printing of functional devices, reducing manufacturing time and labor while preserving device performance.
3Ease of manufacture
If conventional printing methods are used, then manufacturing cost is reduced, but the ability to print functional electronic devices is limited
Solution Approach 1:
The invention creates a composite printing medium consisting of liquid or gel suspended in a carrier fluid, containing entire functional diodes. This composite material combines the low-cost printing approach with the capability to deposit functional electronic components, enabling cost-effective manufacturing of LED devices and photovoltaic panels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and simplifies the manufacturing process, making LED-based devices and photovoltaic panels more affordable and accessible for consumer and business use by utilizing a printable diode ink that can be applied through screen printing or flexographic printing.
Implementation Method 1
A liquid or gel suspension of fully formed, functioning diodes or two-terminal integrated circuits is developed, capable of being printed using screen printing or flexographic printing
Implementation Method 2
Apparatus with Light Emitting or Absorbing Diodes
Implementation Method 3
photovoltaic devices and methods of manufacturing same
Data Source
AI summary
An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. An exemplary apparatus comprises: a plurality of diodes; at least a trace amount of a first solvent; and a polymeric or resin film at least partially surrounding each diode of the plurality of diodes. Various exemplary diodes have a lateral dimension between about 10 to 50 microns and about 5 to 25 microns in height. Other embodiments may also include a plurality of substantially chemically inert particles having a range of sizes between about 10 to about 50 microns.


