Printable Diode Suspension for Low-Cost LED Manufacturing
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Solution Overview
Problem
Current methods for manufacturing light emitting diodes (LEDs) and photovoltaic devices are costly and labor-intensive, involving complex processes that make them unsuitable for widespread consumer use, as they require semiconductor wafers and intricate assembly processes.
Innovation Solution
A liquid or gel suspension of fully formed diodes or two-terminal integrated circuits is developed, capable of being printed using screen printing or flexographic printing, comprising diodes suspended in a solvent and viscous resin mixture, allowing for the creation of LED-based devices and photovoltaic panels with reduced manufacturing costs and complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional semiconductor wafer processes are used to manufacture LEDs and photovoltaic devices, then manufacturing precision and device reliability are improved, but manufacturing cost and process complexity increase significantly
Solution Approach 1:
The patent extracts the diode structure from traditional semiconductor wafer processes and places fully formed diodes into a liquid or gel suspension medium. This allows the diodes to be transferred to substrates via printing methods rather than requiring complex wafer fabrication and assembly processes, thereby reducing process complexity while maintaining device reliability
Solution Approach 2:
The patent introduces a liquid or gel suspension as an intermediary medium that carries fully formed diodes to the substrate. This suspension acts as a mediator between the diode manufacturing process and the final device assembly, enabling simplified transfer and positioning without requiring complex semiconductor fabrication equipment and processes
2Manufacturing precision
If traditional semiconductor wafer processes are used to manufacture LEDs and photovoltaic devices, then manufacturing precision is improved, but labor intensity and manufacturing cost increase
Solution Approach 1:
The patent uses printing methods (such as screen printing or flexographic printing) to replicate the pattern of diodes on the substrate. This copying approach allows multiple diodes to be positioned simultaneously with consistent precision, reducing labor intensity and manufacturing cost while maintaining acceptable manufacturing precision for consumer applications
Solution Approach 2:
The patent extracts fully formed diodes from complex semiconductor wafer processes and places them in a printable suspension medium. This enables the use of simpler, more cost-effective printing techniques instead of labor-intensive manual assembly or complex automated picking and placing operations, thereby improving ease of manufacture
3Reliability
If complex assembly processes are used for LED devices, then device reliability is improved, but productivity decreases
Solution Approach 1:
The patent enables continuous printing processes where diodes in liquid or gel suspension can be deposited onto substrates in a continuous manner. This eliminates the need for discrete, step-by-step assembly operations, thereby increasing productivity while maintaining device reliability through consistent process parameters and automated deposition
Data Source
AI summary
An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. In other exemplary embodiments a second solvent is also included, and the composition has a viscosity substantially between about 100 cps and about 25,000 cps at about 25° C. In an exemplary embodiment, a composition comprises: a plurality of diodes or other two-terminal integrated circuits; one or more solvents comprising about 15% to 99.9% of any of N-propanol, isopropanol, dipropylene glycol, diethylene glycol, propylene glycol, 1-methoxy-2-propanol, N-octanol, ethanol, tetrahydrofurfuryl alcohol, cyclohexanol, and mixtures thereof; a viscosity modifier comprising about 0.10% to 2.5% methoxy propyl methylcellulose resin or hydroxy propyl methylcellulose resin or mixtures thereof; and about 0.01% to 2.5% of a plurality of substantially optically transparent and chemically inert particles having a range of sizes between about 10 to about 50 microns.