Printable Silicone Adhesive Composition for Low-Viscosity Inkjet Coating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional curable silicone compositions for forming silicone pressure sensitive adhesives have high viscosities, making them unsuitable for inkjet printing and difficult to achieve thin layers in electronic device fabrication, and solvent-based methods cause non-uniformity and environmental concerns.
Innovation Solution
A curable silicone composition with a maximum viscosity of 100 mPa·s, comprising specific aromatic compounds, alkenyl functional polyorganosilicate resin, and a hydrosilylation reaction catalyst, allowing for inkjet printing and thin layer formation in electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional curable silicone compositions with linear silicone gum and solid tackifier resin are used, then adhesive performance is achieved, but viscosity becomes too high (thousands of mPa·s or higher) for inkjet printing
Solution Approach 1:
The patent changes the chemical composition parameters by replacing conventional linear silicone gum with aromatic compounds containing alkenyl groups and silicon-bonded hydrogen atoms, and replacing solid tackifier resin with alkenyl-functional polyorganosilicate resin. This parameter change reduces viscosity from thousands of mPa·s to below 100 mPa·s while maintaining adhesive performance through the reactive diluent mechanism.
Solution Approach 2:
The patent introduces reactive diluents (alkenyl-functional polyorganosilicate resin and optionally alkenyl-functional polydiorganosiloxane) as intermediary substances that lower the viscosity of the composition. These intermediaries enable the high-viscosity conventional adhesive to be transformed into an inkjet-printable low-viscosity composition without sacrificing adhesive properties.
2Ease of operation
If volatile solvents are added to reduce viscosity for coating, then viscosity decreases, but solvent drying causes non-uniformity, roughness, shrinkage, and environmental problems
Solution Approach 1:
The patent extracts and eliminates volatile solvents from the composition entirely, replacing them with non-volatile reactive diluents (alkenyl-functional polyorganosilicate resin). This removal of harmful volatile solvents prevents solvent drying issues such as non-uniformity, roughness, and shrinkage, while still achieving the required low viscosity for inkjet printing.
Solution Approach 2:
The patent converts the potential harm of using solvents (which cause uniformity issues and environmental problems) into a benefit by using reactive diluents that not only reduce viscosity but also participate in the curing reaction. The reactive diluents become part of the crosslinked network, ensuring uniform curing without solvent-related defects.
3Length of stationary object
If conventional dispensing or lamination methods are used for adhesive application, then adhesive layers can be formed, but achieving layers with thickness≤50 μm is difficult, limiting thin electronic device fabrication
Solution Approach 1:
The patent replaces conventional mechanical application methods (dispensing, lamination) with inkjet printing technology. The low viscosity of the composition (below 100 mPa·s) enables precise inkjet deposition that can form uniform adhesive layers with thickness≤50 μm, which is difficult to achieve with traditional mechanical methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables uniform and environmentally friendly inkjet printing of thin adhesive layers in electronic devices, overcoming viscosity issues and solvent-related problems.
Implementation Method 1
a curable silicone composition with viscosity ≤100 mPa·s... comprising (A) an aromatic compound having two alkenyl groups per molecule... (B) an aromatic compound having two silicon bonded hydrogen atoms per molecule... (G) a hydrosilylation reaction catalyst
Data Source
AI summary
A curable silicone composition has viscosity≤100 mPa·s at 25° C. The composition is suitable for use in a printing method. The composition can cure via hydrosilylation reaction to form a silicone adhesive suitable for use in the field of (opto)electronic device fabrication.