Printbar Molded Fluid Flow Structure for Ink Distribution
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Solution Overview
Problem
Existing inkjet printhead designs require complex and costly structures to distribute ink to printhead dies, which can be mitigated by shrinking the size of printhead dies, but this necessitates changes in supporting structures and fluid routing systems.
Innovation Solution
A molded fluid flow structure with monolithic printhead dies and channels that eliminate the need for discrete fluid fan-out components, using long, narrow printhead die slivers supported in a single body, where ink is distributed directly from a manifold to the dies through narrow ports, allowing for reduced size and cost while maintaining effective fluid flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the size of printhead dies is reduced to lower cost, then die cost decreases, but the supporting structures and fluid routing systems become more complex
Solution Approach 1:
The patent combines the fluid distribution function directly into the printhead die structure by forming channels within the die itself. This integration eliminates the need for separate fluid fan-out components and simplifies the overall fluid routing system while maintaining effective ink distribution to reduced-size dies.
2Device complexity
If discrete fluid fan-out components are eliminated to simplify structure, then device complexity reduces, but ink distribution to printhead dies becomes challenging
Solution Approach 1:
The patent segments the fluid distribution system into multiple narrow channels formed directly within the printhead die. This segmentation allows ink to be efficiently routed to individual dies through integrated channels, maintaining reliable ink distribution while eliminating discrete fan-out components and reducing overall structural complexity.
Data Source
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AI summary
A printbar module and method of forming the same are described. In an example, a printbar module includes a printed circuit board (PCB), a plurality of printhead die slivers, and a manifold. The printhead die slivers are embedded in molding and attached to the PCB. The molding has a plurality of slots in fluidic communication with fluid feed holes of the printhead die slivers. The manifold is in direct fluidic communication with the slots to supply fluid thereto.