Printed Bond Connections for Integrated Circuit Packaging
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Solution Overview
Problem
Conventional integrated circuit packaging using bond wires is prone to failures due to Kirkendall voiding, mechanical strain, and high costs, especially in extreme temperature environments, where gold bond wires are susceptible to degradation and intermetallic compound formation.
Innovation Solution
The method involves using a 3D printer to create printed bond connections between die pads and package leads, eliminating the need for conventional bond wires and their associated failures, by applying conductive materials through extrusion, selective laser sintering, or colorjet printing, which are mechanically coupled to the package base for enhanced reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bond wires are used to connect die pads to package leads, then electrical connections can be established, but the bond wires are susceptible to degradation, Kirkendall voiding, and mechanical strain in extreme temperature environments
Solution Approach 1:
The patent removes bond wires entirely from the packaging process. Instead of using discrete bond wires to connect die pads to package leads, the invention directly bonds the die to the package base with die attach adhesive, eliminating the bond wire component that causes reliability issues in extreme temperature environments
Solution Approach 2:
The patent replaces the mechanical bond wire system with a direct die-to-package base bonding system using die attach adhesive. This substitution eliminates the mechanical strain and degradation issues associated with bond wires by creating a more integrated and stable connection structure
2Reliability
If gold bond wires are used for connections, then electrical conductivity is achieved, but costs increase and susceptibility to intermetallic compound formation occurs
Solution Approach 1:
The patent eliminates the expensive gold bond wire component from the packaging process. By directly bonding the die to the package base with die attach adhesive, the invention removes the need for gold materials and associated manufacturing costs while maintaining connection stability
Solution Approach 2:
The patent discards the conventional bond wire approach (including expensive gold wires) in favor of a more cost-effective die attach adhesive bonding method. This eliminates material costs and simplifies the manufacturing process while achieving the same electrical connection function
3Reliability
If discrete bond wires are attached to die pads and lead frame, then electrical connections are established, but the process requires specialized equipment and increases manufacturing complexity
Solution Approach 1:
The patent removes the complex bond wire attachment process entirely. Instead of requiring specialized equipment to attach discrete bond wires to die pads and lead frame, the invention uses a simpler die attach adhesive bonding process that directly connects the die to the package base, reducing manufacturing complexity
Solution Approach 2:
The patent merges the die attachment and electrical connection functions into a single step. By bonding the die directly to the package base with die attach adhesive, the invention combines what were previously separate functions (die mounting and electrical interconnection) into one integrated process, simplifying manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces stress on connections, eliminates points of failure like ball bonds, and provides improved reliability and cost-effectiveness by creating strong connections without relying on the integrity of existing ball bonds, while also being suitable for a broader temperature range.
Implementation Method 1
The one or more printed bond conductors are applied by one of an extrusion, selective laser sintering, and colorjet printing process.
Implementation Method 2
The one or more printed bond conductors are applied by one of an extrusion, selective laser sintering, and colorjet printing process.
Implementation Method 3
securing the die to the package base with a die attach adhesive
Data Source
AI summary
A method for assembling a packaged integrated circuit is provided. The method includes placing a die into a cavity of a package base, securing the die to the package base with a die attach adhesive, printing a bond connection between a die pad of the die and a lead of the package base or a downbond, and sealing a package lid to the package base.