Printed Circuit Film Bonding Layout for Side-Bond Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The alignment error between a lead of the printed circuit film and the pad of a display panel causes increased contact resistance and short circuits when using a side-bonding method, complicating the fabrication process of display devices.
Innovation Solution
A printed circuit film design with a base film and lead wires, featuring a conductive member and non-conductive members arranged to overlap the lead wires, ensuring they do not overlap adjacent spaces, and a bonding member that includes a conductive member for electrical connection and non-conductive members for physical attachment, simplifying the alignment process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a side-bonding method is used to bond the printed circuit film to the display panel, then the bezel-less design can be implemented, but an alignment error between the lead and pad is caused, increasing contact resistance and causing short circuits
Solution Approach 1:
The bonding member is divided into three distinct portions: a first non-conductive portion for mechanical bonding, a conductive portion for electrical connection, and a second non-conductive portion for insulation. This segmentation allows each portion to perform its specific function optimally, ensuring both alignment accuracy and electrical performance in the side-bonding configuration
Solution Approach 2:
The bonding member acts as an intermediary component between the printed circuit film and the display panel. It provides a standardized bonding interface with pad structures that align with the leads, eliminating direct lead-to-pad alignment requirements and preventing short circuits while enabling bezel-less design
2Ease of manufacture
If the alignment error between lead and pad is not controlled, then the fabrication process remains simple, but contact resistance increases and short circuits occur
Solution Approach 1:
The bonding member is pre-formed with specific pad structures and conductive patterns before bonding to the display panel. This preliminary preparation ensures that alignment features are already in place, making the subsequent bonding process simple while guaranteeing reliable electrical connections without requiring high-precision lead-to-pad alignment
Solution Approach 2:
The bonding member serves as a mediator that decouples the electrical connection function from the mechanical bonding function. Its pre-formed conductive portions and pad structures ensure reliable electrical connections regardless of minor alignment variations, maintaining both manufacturing simplicity and connection reliability
3Reliability
If the conductive member is disposed to overlap the lead wires, then electrical connection is achieved, but short circuit between adjacent wires may occur
Solution Approach 1:
The conductive member is configured with localized conductive regions that precisely overlap only the intended lead wires, while non-conductive portions are positioned between adjacent leads. This local differentiation of conductive and non-conductive properties ensures reliable electrical connection to specific leads while preventing short circuits between adjacent wires
Data Source
AI summary
A method of fabricating a printed circuit film including the steps of preparing a base film, and a plurality of lead wires disposed on the base film, the plurality of lead wires spaced apart from each other in a first direction and extending in a second direction intersecting the first direction, and forming a bonding member including a conductive member disposed to overlap a central portion of each of the plurality of lead wires, a first non-conductive member disposed to overlap a first portion of the plurality of lead wires in the second direction, and a second non-conductive member disposed to overlap a second portion of the plurality of lead wires in the second direction.