Printed CMP Particles for Stable Semiconductor Polishing
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Solution Overview
Problem
Challenges in semiconductor device manufacturing include achieving improved quality, yield, performance, and reliability while reducing complexity during the scaling-down process, particularly in Chemical Mechanical Planarization (CMP) operations.
Innovation Solution
A polishing composition using printed particles fabricated by additive manufacturing, specifically through two-photon polymerization with femtosecond lasers, which reduces structural variation and allows for customized shape, dimension, surface charge, and size distribution of particles, thereby improving process stability and control in CMP operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional polishing particles are used in CMP operations, then manufacturing process is established, but batch-to-batch variation occurs due to structural differences between particles
Solution Approach 1:
The patent applies parameter changes by transitioning from conventional manufacturing methods to additive manufacturing for polishing particles. This manufacturing method enables precise control over particle parameters including size, shape, and surface properties, thereby reducing batch-to-batch variation and improving process stability in CMP operations.
Solution Approach 2:
The patent replaces conventional mechanical manufacturing methods with additive manufacturing technology. This substitution enables layer-by-layer construction of particles with controlled structural characteristics, reducing variability and improving reliability of CMP processes through more precise particle fabrication.
2Manufacturing precision
If additive manufacturing is used to fabricate printed particles, then manufacturing precision is improved with reduced structural variation, but device complexity increases due to advanced manufacturing equipment required
Solution Approach 1:
The patent applies self-service by enabling the additive manufacturing process to automatically control particle formation with precise dimensional accuracy. The system self-regulates particle fabrication parameters including size and shape control, reducing the need for complex post-processing and manual adjustments despite the advanced equipment involved.
Solution Approach 2:
The patent utilizes parameter changes in the additive manufacturing process to achieve precise particle dimensions. By controlling manufacturing parameters such as layer thickness, curing conditions, and material composition, the system achieves high manufacturing precision while managing equipment complexity through optimized process parameters.
3Productivity
If conventional polishing particles are used, then equipment complexity is maintained at current levels, but polishing consistency deteriorates due to particle variation
Solution Approach 1:
The patent applies parameter changes by implementing controlled variables in the additive manufacturing process for particle fabrication. This includes controlling particle size distribution, shape uniformity, and surface characteristics, which directly improve polishing consistency and productivity while managing fabrication process complexity through systematic parameter optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of additive manufacturing reduces batch-to-batch variation in CMP processes, enhances process stability, and simplifies control, leading to improved polishing efficiency and consistency in semiconductor device manufacturing.
Implementation Method 1
focusing the parallel beams, by focusing lens, in the light-sensitive material to form a planar graph composed of multiple focal points, where the light-sensitive material at all focal points is solidified, thereby achieving one-time projection forming
Data Source
AI summary
The present application discloses a polishing composition including printed particles and a method for fabricating the printed particles. The polishing composition includes a liquid carrier; and printed particles dispersed in the liquid carrier. The printed particles are fabricated by additive manufacturing. The additive manufacturing is one of two-photon polymerization, projection microstereolithography, and direct ink writing.