3D-Printed CMP Polishing Particles for Stable Process Control
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Solution Overview
Problem
Challenges arise in achieving improved quality, yield, performance, and reliability, and reduced complexity during the scaling-down process of semiconductor devices, particularly in Chemical Mechanical Planarization (CMP) operations due to batch-to-batch variation in abrasive particles.
Innovation Solution
A polishing composition utilizing printed particles fabricated by additive manufacturing, specifically through two-photon polymerization using femtosecond lasers, which reduces structural variation and allows for customized shape, dimension, surface charge, polarity, and size distribution of particles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional abrasive particles are used in CMP operations, then manufacturing process can be maintained, but batch-to-batch variation occurs leading to poor process stability
Solution Approach 1:
The patent changes the manufacturing method of abrasive particles from conventional techniques to additive manufacturing (3D printing). This parameter change enables precise control over particle properties including size, shape, and surface characteristics, thereby reducing batch-to-batch variation and improving process stability in CMP operations
Solution Approach 2:
The patent replaces conventional mechanical particle generation methods with additive manufacturing technology. This substitution allows for digital control of particle formation, enabling consistent reproduction of particle structures across batches and eliminating the variability inherent in traditional mechanical manufacturing approaches
2Reliability
If additive manufacturing is used to fabricate particles, then batch-to-batch variation is reduced, but manufacturing process complexity increases
Solution Approach 1:
The patent uses additive manufacturing to create precise digital copies of ideal particle structures. By using digital models as templates for particle fabrication, the process achieves high consistency across batches while the complexity is managed through software-based design rather than complex physical manufacturing equipment
3Ease of operation
If conventional particle manufacturing is used, then process control is complicated due to variation, but manufacturing method is simpler
Solution Approach 1:
The patent performs preliminary action by defining the exact particle specifications (size, shape, surface properties) in the digital design phase before manufacturing. This pre-planning ensures that particles are manufactured with precise control over their properties, eliminating the need for complex post-manufacturing adjustments and simplifying process control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of additive manufacturing reduces batch-to-batch variation in CMP operations, improving process stability and simplifying control, while enabling customized particle properties to meet specific process requirements.
Implementation Method 1
a first layer of cross-section structures of a first layer of cross-section graphs of the particles is formed by two-photon polymerization
Implementation Method 2
activating a femtosecond laser to generate femtosecond laser beams
Data Source
AI summary
The present application discloses a polishing composition including printed particles and a method for fabricating the printed particles. The polishing composition includes a liquid carrier; and printed particles dispersed in the liquid carrier. The printed particles are fabricated by additive manufacturing. The additive manufacturing is one of two-photon polymerization, projection microstereolithography, and direct ink writing.