Printed Coil Sensor Layout for Shielded High-Sensitivity Detection
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Solution Overview
Problem
Inductive sensors face limitations in the number of coil windings due to space constraints from vias and shielding rings, which affects signal sensitivity and interference shielding.
Innovation Solution
The sensor element features a circuit board with printed coils, where first vias are arranged on the edge, allowing for maximum surface coverage by the coil windings, and shielding rings are strategically placed between vias and coils for effective shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vias and shielding rings are arranged on the circuit board, then electrical connection and interference shielding are achieved, but the available surface area for coil windings is reduced
Solution Approach 1:
The patent moves the first via from the traditional position within the coil area to the edge of the circuit board. This dimensional relocation allows the via to be positioned outside the outermost coil winding, effectively removing it from the competing space for surface area. The via remains functional for electrical connection while no longer competing with coil windings for board space, thus resolving the contradiction between shielding reliability and winding surface area.
2Measurement precision
If more coil windings are placed on the circuit board, then signal sensitivity increases, but the surface area available for windings is limited by vias and shielding rings
Solution Approach 1:
By relocating the first via to the edge of the circuit board and positioning it outside the outermost coil winding, the patent maximizes the surface area available for coil windings. This dimensional repositioning removes the via from the space competition, allowing the coil to utilize nearly the entire available board surface, thereby increasing the number of windings and improving signal sensitivity.
3Measurement precision
If the circuit board is made larger to accommodate more coil windings, then signal sensitivity improves, but the first vias would occupy more surface area
Solution Approach 1:
The patent extracts the first via from the interior region where it would compete with coil windings for space. By taking out the via and repositioning it at the edge of the circuit board, outside the outermost coil winding, the design eliminates the via's space occupation from the coil winding area. This allows the coil to expand and utilize maximum board surface area, improving signal sensitivity without the via occupying valuable winding space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a higher degree of signal sensitivity and effective shielding from interference, allowing for reliable detection of metallic objects even in metallic surroundings and strong electromagnetic fields.
Implementation Method 1
A shielding is arranged between the first via and the outer coil windings... for effective shielding from interference
Implementation Method 2
inductive sensor, which has several sensor elements... reliable detection of metallic objects
Data Source
AI summary
A sensor element (10) has a circuit board (11), which has at least one plane having a printed coil (12). The printed coil (12) has at least one first via (15), which is arranged outside an outermost coil winding (13). A shielding ring (17) is arranged between the first via (15) and the outermost coil winding (13). An inductive sensor has several such sensor elements (10).