Printed Coil Tuning With Via-Fed Dual-Side Conductive Ink
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Solution Overview
Problem
Existing flexible hybrid electronics (FHE) processes are costly and complex, limiting the efficiency and performance of simultaneous printing of electrical devices on flexible substrates with effective electrical connections.
Innovation Solution
A method involving the simultaneous printing of circuit elements on the top and bottom surfaces of a flexible substrate using conductive ink, where the ink flows through vias to establish electrical connections, reducing complexity and enhancing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional FHE processes are used to print circuit elements on flexible substrates, then electrical connections can be established, but the process becomes costly and complex
Solution Approach 1:
The patent combines the printing of top surface circuit elements and bottom surface circuit elements into a single simultaneous printing operation. The printing head prints conductive ink on both surfaces of the flexible substrate at the same time, merging two separate printing processes into one unified process. This reduces process complexity and cost while maintaining reliable electrical connections through the substrate via the vias.
2Productivity
If conventional FHE processes are used for printing electrical devices, then device functionality is achieved, but production efficiency and performance are limited
Solution Approach 1:
The patent implements continuous simultaneous printing of circuit elements on both top and bottom surfaces of the flexible substrate in a single uninterrupted process. The printing head moves across the substrate printing conductive ink on both surfaces continuously, eliminating the need to stop, reposition, or reorient the substrate between printing operations. This continuous action maximizes productivity while ensuring reliable electrical connections are established through the vias.
3Manufacturing precision
If multiple printing steps are used for top and bottom surfaces separately, then precise electrical connections can be made, but process cost and complexity increase
Solution Approach 1:
The patent merges the printing operations for top surface and bottom surface into a single simultaneous process. The printing head is configured to deposit conductive ink on both surfaces at the same time, ensuring that vias are precisely aligned and filled with conductive material in one operation. This approach maintains manufacturing precision for via alignment while dramatically simplifying the manufacturing process by eliminating multiple separate printing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the FHE process, reduces costs, and improves the performance of electrical devices by enabling efficient electrical connections between top and bottom surface circuit elements, facilitating the production of flexible, high-capability electronic devices.
Implementation Method 1
printing the circuit elements on the top and bottom surfaces of the substrate causes the ink to flow through the vias to provide an electrical connection
Data Source
AI summary
A method for flexible hybrid electronics (FHE) simultaneous printing of a plurality of electrical devices. The method includes providing a flexible substrate having a top surface and a bottom surface and providing vias through the substrate for all of the plurality of electrical devices. The method also includes printing circuit elements for the plurality of devices on the top surface of the substrate using a conductive ink, and printing circuit elements for the plurality of devices on the bottom surface of the substrate using the conductive ink, where printing the circuit elements on the top and bottom surfaces of the substrate causes the ink to flow through the vias to provide an electrical connection between the circuit elements on the top and bottom surfaces.