3D-Printed Cold Plates for Embedded Power Device Cooling
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Solution Overview
Problem
Conventional methods for forming cold plates and embedding power devices in driver boards are limited by complexity, material usage, and leakage issues, making them inefficient and costly.
Innovation Solution
Utilizing 3D printing to create a monolithic cold plate with embedded fins, conductor substrate, and electrical insulation layer, which allows for complex geometries and seamless integration of power devices, reducing material usage and eliminating bonding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional lamination and machining processes are used to form cold plates and embed power devices, then high power density can be achieved, but the process complexity and manufacturing cost increase significantly
Solution Approach 1:
The patent combines multiple separate manufacturing operations (cold plate formation, power device embedding, electrical insulation layer creation, and conductor substrate integration) into a single 3D printing process. This merging eliminates the need for sequential lamination and machining steps, reducing process complexity while maintaining high power density through integrated monolithic structure fabrication.
2Reliability
If conventional lamination and machining processes are used to form cold plates, then power devices can be embedded, but material usage increases and leakage issues arise
Solution Approach 1:
The 3D printing process fabricates the cold plate, electrical insulation layer, and conductor substrate as a single integrated monolithic structure, eliminating material waste associated with separate manufacturing and assembly processes. This approach reduces excess material usage while ensuring reliable power device embedding through seamless integration without bonding interfaces that could cause leakage.
3Reliability
If conventional machining processes are used to form cold plates, then power devices can be embedded, but the production time and manufacturing cost increase
Solution Approach 1:
The patent integrates multiple manufacturing steps into a single 3D printing operation, creating the cold plate with embedded electrical insulation layers and conductor substrates in one continuous process. This eliminates sequential machining operations and assembly steps, significantly reducing production time while maintaining reliable power device embedding through the monolithic structure.
4Reliability
If conventional lamination processes are used to form cold plates, then power devices can be embedded, but bonding processes are required which increase complexity and potential leakage points
Solution Approach 1:
The 3D printing process creates the cold plate, electrical insulation layer, and conductor substrate as a single monolithic structure without requiring separate bonding operations. This eliminates multiple bonding interfaces that could serve as leakage points, reducing process complexity while improving reliability through seamless integration of all components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D printed cold plates offer enhanced thermal performance, reduced weight, and streamlined production, with improved heat dissipation and reduced leakage risks, enabling more efficient cooling of power devices.
Implementation Method 1
The 3D printed cold plates offer enhanced thermal performance, reduced weight, and streamlined production, with improved heat dissipation
Implementation Method 2
A plurality of fins may be positioned in the hollow interior recess... inlet port and outlet port may be fluidly coupled to the hollow interior recess
Data Source
AI summary
A method includes printing, using a 3D printer, a cold plate, printing, using a 3D printer, an electrical insulation layer embedded in a top surface of the cold plate, and printing, using a 3D printer, a conductor substrate embedded in the electrical insulation layer embedded in the top surface of the cold plate.