Printed Cooler Assembly With Dielectric Isolation for TIM-Free Heat Transfer
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Solution Overview
Problem
Existing thermal management systems for electrical components, such as semiconductor dies, face challenges with insufficient thermal conduction due to thermal interface materials (TIMs) that degrade over time, and integration issues with direct bonding methods due to thermal expansion mismatches and large surface areas, limiting effective heat transfer and component lifespan.
Innovation Solution
A heat exchanger system with a dielectric layer and a thermally conductive conductor layer, compatible with metallurgical bonding, is used to thermally couple and electrically isolate electrical components, eliminating the need for TIMs and metallized ceramic substrates, enhancing heat exchange and component lifespan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal interface material (TIM) is used to improve thermal contact, then thermal conduction is improved, but TIM degrades over time and loses effectiveness
Solution Approach 1:
The patent removes the thermal interface material (TIM) from the thermal management system and replaces it with a direct metallurgical bond between the power device and heat exchanger. This extraction eliminates the degradation issue of TIM while maintaining thermal conduction through a more durable bonding interface.
Solution Approach 2:
The patent employs a composite structure consisting of a dielectric layer combined with a metallurgical bond. The dielectric layer provides electrical isolation while the metallurgical bond ensures strong thermal and mechanical coupling, creating a composite solution that addresses both thermal conduction and long-term reliability.
2Reliability
If direct metallurgical bonding is used to eliminate TIM, then thermal conduction is improved, but thermal expansion mismatches and large surface areas cause difficulties in creating reliable joints
Solution Approach 1:
The patent applies local quality by using a dielectric layer in specific regions where electrical isolation is needed, while allowing direct metallurgical bonding in other regions for optimal thermal conduction. This localized approach enables reliable joints by addressing thermal expansion mismatches only where necessary while maintaining strong bonding elsewhere.
Solution Approach 2:
The dielectric layer serves as an intermediary between the power device and heat exchanger, providing electrical isolation while allowing thermal conduction. This intermediary resolves the conflict between achieving reliable metallurgical bonds and preventing electrical short circuits in large surface area applications.
3Productivity
If coolant flow rate is increased to improve heat transfer, then heat exchange rate is improved, but pressure drop of the cooler increases
Solution Approach 1:
The patent changes the thermal interface parameters by eliminating TIM and improving bonding quality, which enhances heat transfer efficiency at lower coolant flow rates. This parameter change allows achieving the same heat exchange rate with reduced pressure drop compared to traditional TIM-based systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system improves thermal conduction and electrical isolation, increasing heat exchange rates and extending the lifespan of electrical components by directly integrating them with the heat exchanger using dielectric and conductive layers, without the limitations of traditional TIMs.
Implementation Method 1
a layer of dielectric material printed between the heat exchanger to electrically isolate the electrical components from the heat exchanger
Implementation Method 2
a layer of conducting material that is thermally and electrically conductive and compatible with metallurgic bonding techniques
Implementation Method 3
The use of the conductive material compatible with metallurgic bonding techniques may allow for the electronic components and/or other electrical components to have greater thermal conduction with the heat exchanger
Implementation Method 4
a heat exchanger with an electrically isolated surface that is compatible with metallurgical bonding techniques
Data Source
AI summary
A cooler assembly, comprising: a heat exchanger with a heat exchanger surface having a dielectric layer of dielectric material physically coupled thereto, wherein a single or plurality of layers of another material are coupled to an exposed surface of the dielectric layer; and at least one component coupled to the heat exchanger such that the at least one component is electrically isolated from the heat exchanger surface by the dielectric material, wherein the heat exchanger surface is electrically isolated with respect to the at least one component.