Printed De-coupling Plane for PCB Noise Reduction
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Solution Overview
Problem
The existing printed circuit boards (PCBs) require multiple internal copper layers for noise de-coupling and electromagnetic compatibility, which increases material costs and environmental impact due to energy-intensive manufacturing processes.
Innovation Solution
The implementation of printed de-coupling planes using conductive ink on the PCBs, which serves as a high-frequency current return path and common electrical ground, reducing the need for internal copper layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple internal copper layers are used for noise de-coupling, then electromagnetic compatibility is improved, but material cost and manufacturing complexity increase
Solution Approach 1:
The patent uses printed de-coupling planes as a copy or alternative representation of traditional laminated copper de-coupling layers. Instead of using multiple physical copper layers, the invention creates equivalent electromagnetic shielding and de-coupling functionality through printed conductive patterns on the PCB surface, thereby reducing structural complexity while maintaining EMC performance
Solution Approach 2:
The invention changes the physical state and application method of conductive materials from bulk laminated copper layers to printed conductive ink patterns. This parameter change allows for reduced material thickness and simplified layer structure while achieving the same de-coupling function through optimized printed trace geometry and conductivity
2Reliability
If multiple internal copper layers are used for noise de-coupling, then electromagnetic compatibility is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive multi-layer copper laminations with printed de-coupling planes that can be manufactured using standard PCB printing processes. This copying approach achieves equivalent EMC functionality at lower material and processing costs
Solution Approach 2:
The invention employs printed conductive patterns that can be produced more economically than traditional copper layers. The printed de-coupling planes use less expensive materials and simpler manufacturing steps, reducing overall PCB production cost while maintaining functional performance
3Reliability
If multiple internal copper layers are used for noise de-coupling, then electromagnetic compatibility is improved, but energy consumption increases
Solution Approach 1:
The patent changes the manufacturing process from energy-intensive copper lamination and etching to lower-energy printed circuit board printing techniques. This parameter change significantly reduces the energy required for production while achieving the same de-coupling effect through printed conductive patterns
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes the number of internal copper layers, resulting in cost savings, reduced environmental impact, and improved manufacturing efficiency while maintaining effective noise de-coupling and electromagnetic compatibility.
Implementation Method 1
a first de-coupling plane printed on the printed circuit board using conductive ink
Implementation Method 2
a first solder mask applied over the first copper layer and the first side of the substrate to seal the first array of conductive metallic paths from an external environment
Data Source
AI summary
Printed circuit boards (PCBs) are a fundamental component used in nearly all electronics. PCBs provide electrical connections and mechanical support to electronic components and are generally made of copper layers laminated onto, though, and/or between one or more non-conductive substrate layers. Depending on the circuit complexity and performance requirements, multiple copper layers may be utilized in a singular PCB. Beyond two copper layers, the material cost and environmental impact of adding additional copper layers to a PCB increases dramatically. Multiple internal conductive layers (e.g., copper clad laminates or CCL's) within a PCB are created using an energy intensive process, requiring substantial amounts of water and chemicals. Significant environmental savings and PCB manufacturing cost reductions can be achieved if a PCB design can minimize the number of internal conductive layers, including using one or more printed de-coupling layers in place of laminated copper layers.