3D-Printed Heat Spreader Structure for Multi-Die Package Cooling
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Solution Overview
Problem
The increasing clock frequencies and power densities of integrated circuits (ICs) lead to significant heat dissipation challenges, as the performance and reliability of ICs degrade with higher temperatures, necessitating effective heat management in electronic packaging.
Innovation Solution
A printed heat spreader structure is fabricated using three-dimensional (3D) printing to deposit layers of high thermal conductivity materials like copper or silver, with pore structures to enhance heat conduction, which is thermally coupled to IC dies and further integrated with heat sinks and fins to dissipate heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If IC clock frequencies and power densities are increased to improve performance, then processing speed and computational capability are improved, but heat generation increases causing temperature to rise and reliability to degrade
Solution Approach 1:
The patent extracts the heat management function from the IC package structure by adding a dedicated heat spreader component. This heat spreader is thermally coupled to the IC die to conduct heat away from the heat-generating regions, effectively separating the heat dissipation function from the electrical interconnection function and enabling higher power densities without excessive temperature rise
Solution Approach 2:
The patent introduces a heat spreader as an intermediary thermal management component between the IC die and the external environment. This heat spreader acts as a thermal mediator that conducts heat from the IC die through highly conductive material pathways, distributing the heat load and reducing peak temperatures at the IC junctions
2Quantity of substance
If more IC components are packed into smaller areas to increase density, then component count per area is improved, but heat dissipation becomes more difficult and thermal management complexity increases
Solution Approach 1:
The patent merges multiple thermal management functions into a single integrated heat spreader structure. This heat spreader simultaneously provides thermal conduction pathways, heat distribution, and structural support functions, consolidating what would otherwise require multiple separate components and simplifying the thermal management system while supporting higher component densities
Solution Approach 2:
The heat spreader is designed as a multi-functional component that serves both thermal management and structural purposes. It provides thermal conduction to manage heat from high-density IC components while also serving as a mechanical support structure and potential EMI shield, reducing the overall complexity of the package design
3Ease of manufacture
If conventional heat dissipation methods are used, then manufacturing simplicity is maintained, but heat dissipation effectiveness is insufficient for high power density ICs
Solution Approach 1:
The patent changes the thermal conductivity parameter of the heat spreader material to highly conductive materials (such as copper or aluminum with thermal conductivity significantly higher than conventional package materials). This parameter change enables effective heat dissipation from high power density ICs while maintaining compatibility with standard semiconductor manufacturing and assembly processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat dissipation from ICs, maintaining performance and reliability by providing a robust thermal management system that accommodates varying IC die heights and reduces thermal conductivity between components, thereby mitigating the effects of high clock frequencies and power densities.
Implementation Method 1
A printed heat spreader structure is fabricated using three-dimensional (3D) printing to deposit layers of high thermal conductivity materials like copper or silver
Implementation Method 2
further integrated with heat sinks and fins to dissipate heat effectively
Data Source
AI summary
Techniques and mechanisms for promoting heat conduction in a packaged device using a heat spreader that is fabricated by a build-up process. In an embodiment, 3D printing of a heat spreader successively deposit layers of a thermal conductor material, where said layers variously extend each over a respective one or more IC dies. The heat spreader forms a flat top side, wherein a bottom side of the heat spreader extends over, and conforms at least partially to, different respective heights of various IC dies. In another embodiment, fabrication of a portion of the heat spreader comprises printing pore structures that contribute to a relatively low thermal conductivity of said portion. An average orientation of the oblong pores contributes to different respective thermal conduction properties for various directions of heat flow.