Printed Resistive Heater for Low-Temperature Flexible Substrates
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Solution Overview
Problem
Existing resistive heater structures are not suitable for reliable application on flexible plastic substrates due to their inability to withstand high processing temperatures during electronic circuit manufacturing.
Innovation Solution
A printed resistive heater comprising a flexible plastic substrate with a resistive heating layer and conductive bus electrodes formed by a printing process, using inks or pastes, enabling integration into lightweight and bendable devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional fabrication techniques are used to produce resistive heaters, then the heaters can provide localized heating, but they cannot be reliably applied on flexible plastic substrates due to high processing temperatures
Solution Approach 1:
The patent changes the processing parameters by using printed electronics fabrication methods instead of conventional high-temperature techniques. This allows the heater to be manufactured at lower temperatures compatible with flexible plastic substrates while maintaining heating functionality.
Solution Approach 2:
The patent replaces conventional mechanical fabrication techniques with printed electronics processes. The resistive heating layer and conductive bus electrodes are deposited through printing methods, eliminating the need for high-temperature processing associated with traditional fabrication.
2Ease of manufacture
If printed electronics methods are used to manufacture heaters on flexible substrates, then cost-efficient manufacturing and integration into lightweight devices are achieved, but the substrates are limited in withstanding high processing temperatures
Solution Approach 1:
The patent modifies the processing temperature parameters to be compatible with flexible plastic substrates. By using printed electronics methods, the manufacturing process operates at lower temperatures that do not degrade the substrate, while maintaining cost efficiency through additive manufacturing.
Solution Approach 2:
The patent employs composite material structures including the resistive heating layer formed from conductive ink or paste containing metal particles or carbon, combined with flexible plastic substrates. This composite approach enables low-temperature processing while achieving the desired electrical and thermal properties.
3Reliability
If known heater structures are used, then localized heating can be provided, but they are not suitable for reliable use with flexible plastic substrates
Solution Approach 1:
The patent replaces complex conventional heater structures with simplified printed patterns. The resistive heating layer and conductive bus electrodes are formed through printing processes, creating integrated structures that are inherently suitable for flexible substrates without requiring complex assembly or additional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cost-efficient manufacturing of heaters on flexible substrates, suitable for integration into lightweight and bendable devices, operating at supply voltages between 6 and 48 V and reaching temperatures up to 100°C.
Implementation Method 1
resistive heating layer electrically connected to opposite sides of the heating layer
Data Source
AI summary
A printed resistive heater has a flexible plastic substrate; a resistive heating layer applied on the substrate; and conductive bus electrodes electrically connected to opposite sides of the heating layer. The heating layer and the bus electrodes are formed by a printing process from ink or paste.