Printed Heater and Sensor for Uniform Thermal Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heater jackets used in semiconductor device fabrication are bulky and provide inconsistent heating, leading to poor thermal uniformity, while traditional temperature sensors often suffer from contact mismatch or misplacement, resulting in inaccurate temperature readings and ineffective temperature regulation.
Innovation Solution
A system comprising a printed heater and temperature sensor affixed to the outer surface of components, with a controller to manage power to the heater based on sensor data, ensuring precise temperature control across semiconductor processing systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heater jackets are used to heat components, then heating capability is provided, but the heater jackets are bulky and do not provide sufficient heating or thermal uniformity
Solution Approach 1:
The patent applies a thin-film heater directly to the outer surface of the component instead of using a bulky heater jacket. This thin-film heating element provides close contact with the component surface, enabling uniform heat distribution while eliminating the bulkiness of traditional heater jackets.
Solution Approach 2:
The patent combines the heater and temperature sensor into an integrated assembly that is affixed to the component surface. This merging of heating and sensing functions into a single low-profile unit eliminates the need for separate bulky heater jackets and improves thermal uniformity through direct surface contact.
2Measurement precision
If conventional temperature sensors are used to monitor component temperature, then temperature monitoring is provided, but contact mismatch or misplacement results in inaccurate temperature readings
Solution Approach 1:
The patent integrates the temperature sensor with the heater in a single affixed assembly, ensuring that the sensor is positioned in optimal thermal contact with the component surface. This integration eliminates contact mismatch and misplacement issues that occur with separate sensor and heater installations.
Solution Approach 2:
The patent implements a feedback control system where the temperature sensor continuously monitors the component surface temperature and provides real-time data to control the heater power. This closed-loop feedback ensures accurate temperature readings are used to maintain precise temperature regulation, improving both measurement precision and regulatory reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a low-profile, uniformly heated surface with accurate temperature monitoring and control, enhancing thermal regulation and consistency in semiconductor processing systems.
Implementation Method 1
a printed heater affixed to an outer surface of the component
Implementation Method 2
a printed temperature sensor affixed to the outer surface of the component
Data Source
AI summary
An apparatus may provide a component, such as a showerhead, a pipe, a valve manifold, or a vessel, having a printed heater affixed to an outer surface of the component. In addition, a printed temperature sensor may be affixed to the outer surface of the component. The apparatus may further provide a controller to control the power to the printed heater according to data output from the printed temperature sensor.