Printed Inductive Coil Decoupling for MRI RF Coils
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Solution Overview
Problem
The complexity and deformation of RF coil structures in MRI systems, particularly due to inductors formed from windings, pose challenges for mass production and precision in decoupling between antenna units, leading to increased noise and reduced signal-to-noise ratio.
Innovation Solution
A decoupling device comprising substrates with printed inductive coils and a joining component with a fastener and slot system, allowing for precise adjustment of overlap area and inductance, enabling the use of printed circuit boards to replace metal wire windings, thereby reducing deformation and facilitating high-precision, mass-producible RF coils.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inductive decoupling employs solenoid formed by coaxially interwoven or adjacent inductive coils wound from spiral wires, then decoupling between antenna units is achieved, but the coil structures become complex and deform easily
Solution Approach 1:
The patent replaces the traditional mechanical winding process with a printed circuit board (PCB) fabrication process. The inductive coils are formed by printing conductive patterns on flexible substrates rather than manually winding spiral wires. This substitution eliminates the complexity of manual winding and the associated deformation issues, while maintaining the electromagnetic coupling characteristics necessary for decoupling.
Solution Approach 2:
The patent changes the physical state and formation method of the inductive coils from three-dimensional wound wire structures to two-dimensional printed conductive patterns on flexible substrates. This parameter change allows for precise control of coil geometry, consistent reproduction during manufacturing, and elimination of deformation problems associated with manual winding processes.
2Reliability
If inductive coils are wound from spiral wires, then decoupling function is achieved, but mass production becomes difficult due to deformation
Solution Approach 1:
The patent replaces the mechanical winding process with automated PCB printing technology. The conductive patterns are deposited onto flexible substrates using standard PCB fabrication techniques, enabling consistent mass production without manual intervention. This eliminates the deformation issues that arise from manual winding and allows for high-volume manufacturing with uniform quality control.
Solution Approach 2:
The patent performs the coil formation process during the PCB manufacturing stage, before final assembly. The conductive patterns are printed and cured onto the flexible substrates as part of the base manufacturing process, ensuring that the coil structures are pre-formed with precise dimensions and consistent properties, ready for assembly without requiring subsequent winding or adjustment operations.
3Measurement precision
If the number of RF coil channels is increased, then reception signal-to-noise ratio is improved, but coil structure complexity increases and deformation occurs
Solution Approach 1:
The patent divides the RF coil system into multiple independent antenna units, each with its own printed inductive coil on a separate flexible substrate. This segmentation allows for modular assembly where multiple channels can be added simply by adding more substrate units, rather than increasing the complexity of a single integrated coil structure. Each segment maintains consistent manufacturing processes and geometric properties.
Solution Approach 2:
The patent transitions from three-dimensional wound wire coils to two-dimensional printed conductive patterns on flexible substrates. This dimensional reduction simplifies the overall structure while enabling easier integration of multiple channels. The flat, planar geometry of the printed coils allows for straightforward stacking and arrangement of multiple antenna units without the spatial complexity of wound wire structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves reduced deformation and increased precision in RF coil dimensions, allowing for improved decoupling and signal reception, while enabling mass production of RF coils with minimal errors, thus enhancing the signal-to-noise ratio and reducing noise in MRI systems.
Implementation Method 1
Inductive decoupling may employ a solenoid formed by coaxially interwoven or adjacent inductive coils wound from spiral wires
Implementation Method 2
The joining component includes a fastener and a slot. The fastener is arranged on the first substrate. The slot is arranged on the second substrate, and the fastener engages with the slot
Data Source
AI summary
A decoupling device includes a first substrate, a first inductive coil printed on the first substrate, a second substrate, a second inductive coil printed on the second substrate, and a joining component. The joining component is for joining the first substrate to the second substrate. The first inductive coil and the second inductive coil have an area of overlap.