3D-Printed Low-Profile Interconnects for Light Emitters
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Solution Overview
Problem
Conventional wire bonds in light emitters mounted on substrates limit the spacing of optical structures, leading to reduced light injection efficiency and increased shadow artifacts, while also adding height and material costs.
Innovation Solution
Implement low-profile electrical interconnects formed by 3D printing, which conformally follow the substrate and light emitter contours, allowing closer spacing with optical structures and eliminating the need for encapsulating materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional wire bonds are used to connect light emitters to substrates, then electrical connection is achieved, but the spacing between optical structures is limited and shadow artifacts increase
Solution Approach 1:
The patent removes the traditional wire bond structure from the system and replaces it with a low-profile interconnect formed by 3D printing. This extraction of the problematic wire bond element eliminates the source of shadow artifacts while maintaining the essential electrical connection function between the light emitter and substrate.
Solution Approach 2:
The invention changes the physical parameters of the electrical interconnect by transitioning from a wire bond with significant height and diameter to a 3D printed interconnect with minimal profile. This parameter change reduces the interconnect's height to less than the diameter of the light emitter, thereby minimizing shadow artifacts and enabling closer spacing of optical structures.
2Use of energy by moving object
If conventional wire bonds are used, then electrical connection is provided, but light injection efficiency is reduced
Solution Approach 1:
By removing the wire bond structure that obstructs light paths, the patent enables more efficient light injection from the light emitter into optical structures. The extraction of this blocking element allows light to travel unobstructed, improving overall system efficiency.
Solution Approach 2:
The patent changes the height parameter of the electrical interconnect to be minimal, allowing optical structures to be positioned closer to the light emitter. This parameter change directly improves light injection efficiency by reducing the distance light must travel and minimizing obstructions in the light path.
3Reliability
If conventional wire bonds and encapsulating materials are used, then light emitters are protected and connected, but manufacturing costs increase
Solution Approach 1:
The patent combines the electrical interconnect and protective encapsulation into a single integrated 3D printed structure. This merging eliminates the need for separate wire bonds and encapsulating materials, reducing the number of manufacturing steps and material costs while maintaining both electrical connection and protective functions.
Solution Approach 2:
The 3D printed interconnect serves multiple functions simultaneously: it provides electrical connection, structural support, and protective encapsulation. This multi-functionality replaces multiple separate components (wire bond plus encapsulating material), simplifying manufacturing and reducing costs while maintaining reliability.
4Ease of operation
If conventional wire bonds are used, then electrical connection is achieved, but device height increases
Solution Approach 1:
The patent dramatically changes the height parameter of the electrical interconnect by replacing the wire bond structure with a low-profile 3D printed interconnect. This parameter change reduces the overall height of the light source assembly, enabling more compact device designs and improving ease of operation in space-constrained applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances light injection efficiency, reduces shadow artifacts, and lowers manufacturing costs by enabling closer optical structure placement, resulting in more robust and compact light sources.
Implementation Method 1
low-profile electrical interconnects formed by 3D printing, which conformally follow the substrate and light emitter contours
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
In some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. The interconnect may be deposited by 3D printing and lays flat on the light emitter and substrate. In some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 μιη or less, or about 35 μιη or less. This small height allows close spacing between an overlying optical structure and the light emitter, thereby providing high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.