Printed Membrane Keyboard Circuit for Low-Waste PCB Replacement
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Solution Overview
Problem
The manufacturing techniques for printed circuit boards (PCBs) in computer peripheral devices are energy-intensive and wasteful, leading to significant sustainability issues and challenges in designing robust, high-trace-density circuits for advanced devices like gaming keyboards and mice.
Innovation Solution
The use of printed membranes with conductive ink traces on flexible substrates, coupled with a mechanical support layer, which replaces traditional PCBs, employing additive manufacturing and low-temperature joining techniques to ensure robustness and reduce material waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional PCB manufacturing techniques are used, then reliable circuit connections are achieved, but energy consumption increases and material waste is generated
Solution Approach 1:
The patent changes the manufacturing parameter from subtractive PCB fabrication to additive printing processes. Circuit traces are deposited directly onto flexible substrates using printing techniques, eliminating the need for energy-intensive etching and multiple processing steps required by traditional PCB manufacturing while maintaining electrical connection reliability
Solution Approach 2:
The patent replaces the mechanical subtractive manufacturing system (drilling, etching, laminating) with a non-mechanical additive printing system. Conductive materials are deposited through printing processes that require minimal energy compared to the high-temperature and high-force operations of traditional PCB fabrication
2Reliability
If traditional PCB manufacturing techniques are used, then circuit connections are established, but material waste increases
Solution Approach 1:
The patent transitions from subtractive manufacturing that removes excess material to additive manufacturing that deposits only the required conductive traces. This parameter change in the manufacturing approach eliminates material waste while ensuring reliable circuit connections through precise trace deposition
Solution Approach 2:
The patent extracts only the essential circuit trace patterns needed for functionality, depositing conductive material precisely where required rather than creating entire PCB structures and removing unnecessary portions. This extraction approach minimizes material consumption while maintaining connection reliability
3Loss of substance
If printed membranes with conductive ink traces are used, then sustainability is improved and material waste is reduced, but manufacturing precision challenges arise for high-trace-density circuits
Solution Approach 1:
The patent changes the manufacturing precision parameter by using additive printing technology that can deposit conductive traces with high precision directly onto the substrate. The printing process allows for controlled trace width, spacing, and positioning, achieving the required trace density precision without the material waste associated with traditional PCB methods
Solution Approach 2:
The patent introduces a flexible substrate as an intermediary layer that receives the printed conductive traces. This substrate serves as a precise template and support structure, enabling high-trace-density circuits to be formed with accurate positioning while maintaining the sustainability benefits of additive manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the need for PCBs, providing sustainable and robust electronic assemblies for computer peripherals that can withstand demanding applications while minimizing environmental impact.
Implementation Method 1
The membrane layer may include a printed trace on at least one surface of the membrane layer. The electrical contact may be electrically coupled with the printed trace.
Implementation Method 2
The assemblies may include a mechanical support layer. The membrane layer may be positioned on a downward-facing surface of the mechanical support layer.
Implementation Method 3
an electrical contact that is coupled with the mechanical support layer and that sandwiches the membrane layer between the mechanical support layer and the electrical contact
Data Source
AI summary
Embodiments of the present invention may encompass electronics assemblies of computer peripheral devices. The assemblies may include a mechanical support layer. The assemblies may include a membrane layer coupled with the mechanical support layer. The membrane layer may include a printed trace on at least one surface of the membrane layer. The assemblies may include an electrical contact that is coupled with the mechanical support layer and that sandwiches the membrane layer between the mechanical support layer and the electrical contact. The electrical contact may be electrically coupled with the printed trace.