Printed Package Interconnects for Smaller High-Frequency IC Packaging
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Solution Overview
Problem
The existing wire bonding technology faces challenges in efficiently connecting semiconductor dies to lead frames due to limitations in scaling down package size, high production costs, and increased signal loss at higher operating frequencies.
Innovation Solution
The method involves printing conductive interconnects between bond pads on semiconductor dies and corresponding leads of a lead frame, using techniques such as inkjet printing, instead of traditional wire bonding, and encapsulating these interconnects within insulating layers for protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wire bonding is used to connect bond pads to lead frames, then electrical connections are established, but package size cannot be reduced further due to PCB and SMT process limitations
Solution Approach 1:
The patent replaces the mechanical wire bonding process with a printing process that deposits conductive material directly to form interconnects. This substitution eliminates the need for wire bonding equipment and enables smaller package sizes by directly printing conductive paths on the substrate, thereby resolving the contradiction between package size reduction and manufacturing process limitations.
2Ease of manufacture
If wire bonding is used to achieve interconnects, then electrical connections are formed, but production costs increase
Solution Approach 1:
The printing-based interconnect formation replaces costly wire bonding equipment and materials with a more economical printing process. This substitution reduces production costs while maintaining or improving productivity, as the printing process can be more easily integrated into existing manufacturing workflows and requires less specialized equipment.
3Reliability
If wire bonding is used for interconnects, then electrical connections are established, but signal loss increases at higher frequencies
Solution Approach 1:
The patent replaces wire bonding with a printed conductive interconnect structure that provides better signal integrity at high frequencies. The direct printing of conductive paths on the substrate creates shorter, more controlled transmission lines with reduced inductance and resistance, thereby minimizing signal loss and improving reliability for high-frequency applications.
4Area of moving object
If die size is reduced according to Moore's law, then cost decreases, but PCB geometries do not scale at the same rate requiring larger package area
Solution Approach 1:
The patent uses printed conductive interconnects that can be routed in multiple dimensions and layers on the substrate, enabling more efficient space utilization. This dimensional flexibility allows compact packaging of smaller dies while maintaining appropriate connection spacing for PCB assembly, resolving the mismatch between die scaling and PCB geometry constraints.
Data Source
AI summary
A method for interconnecting bond pads of semiconductor dies or devices with corresponding leads in a lead frame with printed conductive interconnects in lieu of bond wires and an apparatus resulting from the above method. More specifically, some examples include printing an insulating foundation path from bond-pads on a semiconductor die to leads of a lead frame to which the semiconductor die is attached. A foundation conductive trace is printed on top of the insulating foundation path from each bond pad on the die to a corresponding lead of the lead frame. Optionally, on top of the conductive trace, a cover insulating cover layer is applied on exposed portions of the conductive interconnects and the foundation insulating layer. Preferably, this can be the same material as foundation layer to fully adhere and blend into a monolithic structure, rather than separate layers. Optionally, a protective layer is then applied on the resulting apparatus.