Printed Flexible Planar Coils for High-Throughput Manufacturing
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Solution Overview
Problem
Conventional methods for producing inductive coils are resource-intensive, high-cost, and result in performance inadequacies such as acoustic distortion and poor sound quality due to high-vacuum and high-temperature deposition processes.
Innovation Solution
A method and apparatus for forming flexible planar inductive coils using additive manufacturing processes, such as screen printing, gravure printing, and inkjet printing, on conformable substrates like plastic, glass, or textile, balancing ink properties and printing techniques to achieve high throughput and lower costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional high-vacuum and high-temperature deposition processes are used to produce inductive coils, then manufacturing precision and material purity are improved, but resource consumption and production cost increase significantly
Solution Approach 1:
The patent changes the processing parameters from high-vacuum and high-temperature conditions to atmospheric pressure and room temperature conditions by using printing-based deposition methods. This allows the coil to be manufactured without resource-intensive vacuum pumps and heating systems, significantly reducing energy consumption while maintaining acceptable manufacturing precision for the application
Solution Approach 2:
The patent replaces the mechanical vacuum deposition system with a printing-based deposition system. Instead of using vacuum pumps and heated chambers to deposit conductive material, the invention uses printing heads to directly deposit conductive ink or paste onto the substrate, eliminating the need for complex mechanical vacuum and temperature control systems
2Manufacturing precision
If conventional deposition processes are used, then material purity is improved, but production cost and device complexity increase
Solution Approach 1:
The patent replaces complex mechanical vacuum deposition equipment with simple printing equipment. The printing system uses straightforward inkjet or screen printing mechanisms to deposit conductive material, eliminating the need for vacuum chambers, temperature control systems, and complex process equipment, thereby reducing device complexity while maintaining material purity through controlled ink formulation
Solution Approach 2:
The patent changes the process conditions from extreme vacuum and temperature to atmospheric and room temperature conditions. This simplification of processing parameters reduces the complexity of equipment and process control while maintaining adequate material purity for the coil application through proper ink formulation and deposition control
3Reliability
If conventional electronics manufacturing methods are used, then conductivity is improved, but adaptability to flexible substrates and production throughput are reduced
Solution Approach 1:
The patent uses flexible substrates such as plastic films or thin metal foils as the base for the coil structure. The printing-based manufacturing method is inherently suited for flexible substrates, allowing the coil to be produced on bendable and conformable materials without requiring rigid semiconductor wafers or metal plates, thereby enabling adaptability to various form factors while maintaining electrical conductivity through proper conductive ink selection
Solution Approach 2:
The patent replaces conventional electronics manufacturing processes (which require rigid substrates and high-temperature processing) with printing-based deposition that can be performed at room temperature on flexible substrates. This substitution enables the production of conductive coils on flexible materials, improving adaptability without sacrificing electrical performance
4Reliability
If conventional manufacturing methods are used, then electrical performance is improved, but productivity and volume production capability are reduced
Solution Approach 1:
The printing-based manufacturing process allows for continuous deposition of conductive material across large substrate areas. Unlike conventional methods that require sequential processing steps (photolithography, etching, deposition), the printing method can deposit the entire conductive pattern in a single continuous operation, significantly increasing production throughput and enabling volume production while maintaining electrical performance
Solution Approach 2:
The patent changes the manufacturing approach from batch processing in vacuum chambers to continuous printing operations. This parameter change from discrete, resource-intensive steps to continuous, streamlined deposition dramatically improves productivity and enables high-volume production of coils with consistent electrical performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of inductive coils with improved performance and reduced resource consumption, suitable for applications like acoustical devices and wireless power transmission, by optimizing conductivity and resistivity through multi-faceted printing and via connections.
Implementation Method 1
Electrically functional electronic or optical inks are deposited on the substrate using one or more of these printing techniques
Data Source
AI summary
The disclosure provides at least an apparatus, system and method for providing a flexible planar inductive coil, such as may be embedded in a product. The apparatus, system and method may include at least one conformable substrate, and a matched function ink set, printed onto at least one substantially planar face of the at least one substrate. This printing may form at least one layer of additive conductive traces capable of receiving current flow from at least one source and layered into successive ones of the conductive traces about a center axis within a plane of the at least one conformable substrate.