Printed Flexible Planar Coils for Low-Cost High-Throughput Production
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for producing inductive coils are resource-intensive, costly, and result in performance inadequacies such as acoustic distortion due to high-vacuum and high-temperature deposition processes.
Innovation Solution
A method involving additive manufacturing processes to create flexible planar inductive coils on conformable substrates using matched ink sets, allowing for high-volume, low-cost production with optimized conductivity and resistivity through multi-faceted printing on both sides of the substrate and via connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional high-vacuum and high-temperature deposition processes are used to produce inductive coils, then manufacturing precision and material purity are improved, but production cost and resource consumption increase significantly
Solution Approach 1:
The patent changes the processing parameters from high-vacuum/high-temperature conditions to ambient or near-ambient conditions by using printed electronics techniques. This allows production of inductive coils with acceptable precision at significantly lower cost and resource consumption, resolving the contradiction between manufacturing precision and ease of manufacture.
Solution Approach 2:
The patent replaces complex mechanical vacuum deposition systems with simpler printing-based deposition methods. By substituting the mechanical high-vacuum system with printed electronics processes, the patent achieves comparable coil precision while dramatically reducing manufacturing complexity and cost.
2Manufacturing precision
If conventional deposition processes are used, then material purity is improved, but production throughput decreases
Solution Approach 1:
The patent substitutes slow conventional deposition processes with faster printed electronics techniques. Printing methods can deposit conductive materials rapidly while maintaining adequate purity through controlled ink formulations and printing parameters, thereby increasing production throughput without sacrificing essential material quality.
Solution Approach 2:
The patent enables continuous printing processes that can produce inductive coils without the intermittent steps required by conventional deposition. This continuous action increases throughput while maintaining material purity through consistent ink delivery and deposition control.
3Reliability
If high-temperature deposition is used, then electrical conductivity is improved, but energy consumption and substrate limitations increase
Solution Approach 1:
The patent changes the energy parameter from high-temperature processing to lower-energy printing and curing processes. By using conductive inks with appropriate binders and curing methods (such as UV curing or low-temperature sintering), the patent achieves sufficient electrical conductivity for inductive coils while dramatically reducing energy consumption and expanding substrate material options.
Solution Approach 2:
The patent employs composite conductive inks containing metal particles, nanotubes, or other conductive fillers in polymer matrices. These composite materials provide adequate electrical conductivity after low-energy curing, eliminating the need for high-temperature deposition while maintaining reliability of the inductive coil function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-throughput, cost-effective production of inductive coils with improved performance characteristics, suitable for applications like acoustical devices and wireless power transmission, overcoming limitations of conventional techniques.
Implementation Method 1
a conductive ink is printed using one or more printing processes on one or both sides of a substrate to form a multi-layered planar inductive coil
Data Source
AI summary
The disclosure provides at least an apparatus, system and method for providing a flexible planar inductive coil, such as may be embedded in a product. The apparatus, system and method may include at least one conformable substrate, and a matched function ink set, printed onto at least one substantially planar face of the at least one substrate. This printing may form at least one layer of additive conductive traces capable of receiving current flow from at least one source and layered into successive ones of the conductive traces about a center axis within a plane of the at least one conformable substrate.


