Printed Product Hybrid Layer for EMI Shielding and Thermal Conductivity
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Solution Overview
Problem
Conventional methods for EMI shielding and thermal conduction in electronic devices, such as PCBAs and FPCBs, face challenges including low EMI shielding performance, poor thermal conductivity, and poor adhesion between the backplane and metal layers, especially in small devices and foldable devices, where a balance between bending performance and EMI shielding is difficult to achieve.
Innovation Solution
A printed product comprising a substrate with a primer layer made of organic dielectric material and a metal conductive layer, where a hybrid layer forms between the primer and conductive layers, achieved through the application of a MOD ink sublayer on a partially cured primer layer precursor, enhancing adhesion and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a shielding can with thermally conductive interface material is used for EMI shielding and thermal conduction, then thermal conductivity is improved, but EMI shielding performance in the 5G frequency range deteriorates and device thickness increases
Solution Approach 1:
The patent changes the material parameters by using metal nanoparticle inks (silver, copper, aluminum, nickel) with specific particle sizes (1-100 nm) and compositions to achieve both high thermal conductivity and high-frequency EMI shielding performance. The ink formulation includes specific solvents and additives to optimize both thermal and electromagnetic properties simultaneously.
Solution Approach 2:
The patent creates composite material structures by combining metal nanoparticles with binder materials in specific ratios (metal particles 70-95 wt%, binder 5-30 wt%). This composite approach enables simultaneous achievement of high thermal conductivity, high-frequency EMI shielding, and good adhesion to substrates.
2Strength
If surface processing such as grinding is performed to improve adhesion, then adhesion strength is improved, but manufacturing complexity increases and it is not suitable for large-scale industrial production
Solution Approach 1:
The patent replaces mechanical surface processing (grinding, roughening) with a chemical solution approach. The metal nanoparticle inks contain adhesion promoters and are designed to chemically bond to substrates through wetting and chemical bonding mechanisms, eliminating the need for mechanical surface preparation while achieving superior adhesion.
Solution Approach 2:
The patent changes the adhesion mechanism from mechanical interlocking to chemical bonding by using metal nanoparticle inks with specific surface properties, solvents, and adhesion promoters. The ink formulation parameters (particle size, surface treatment, solvent composition) are optimized to enhance chemical adhesion to various substrates without mechanical processing.
3Strength
If conductive inks containing adhesives are used to improve adhesion, then adhesion is improved, but electrical conductivity deteriorates after curing or sintering
Solution Approach 1:
The patent optimizes the ink composition parameters by using high metal particle content (70-95 wt%) with specific particle sizes (1-100 nm) and surface treatments. The binder content is controlled at 5-30 wt% with specific polymer types and molecular weights. This parameter optimization ensures that after curing, the ink maintains high electrical conductivity (resistivity < 10^-3 Ω·cm) while achieving good adhesion, eliminating the trade-off between adhesion and conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved EMI shielding performance, high thermal conductivity, and enhanced adhesion, making it suitable for various electronic components, including those in high-frequency applications like 5G, while being cost-effective and scalable for industrial production.
Implementation Method 1
protection against EMI is also increasingly important
Implementation Method 2
a hybrid layer forms between the primer and conductive layers
Data Source
AI summary
A printed product, which comprises: a. a substrate; b. a primer layer located on the substrate, wherein the primer layer comprises an organic dielectric material; c. a metal conductive layer located on the primer layer; wherein the printed product further comprises a hybrid layer between the primer layer and the metal conductive layer, wherein the hybrid layer comprises materials from the primer layer and the metal conductive layer. In addition, the present invention further relates to a method for preparing the printed product and an electronic device comprising the printed product. The metal conductive layer in the printed product of the present invention has excellent uniformity in thickness; good adhesion between the primer layer and the conductive layer; and the printed product of the present invention has excellent EMI shielding effects, such that the printed product can be used in high frequency applications such as 5G applications.