Redistribution Traces via Printed Droplets for Probe Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for fabricating redistribution traces on electronic components require multiple deposition and etching steps, expensive masks, and generate process waste, making them costly and inefficient.
Innovation Solution
The use of droplets of conductive and non-conductive materials deposited using printing technology to form redistribution traces on a substrate, which can be customized for different electronic components without the need for expensive tools or extensive retooling, utilizing a base substrate with pre-defined terminals and attaching conductive spring probes to form electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple deposition and etching steps are used to fabricate redistribution traces, then manufacturing precision can be improved, but device complexity and production cost increase
Solution Approach 1:
The patent extracts and eliminates the masking step from the traditional multi-step deposition and etching process. By using direct deposition methods to form conductive traces without requiring masks, the fabrication process complexity is reduced while maintaining the ability to create precise redistribution trace patterns on the substrate
Solution Approach 2:
The patent merges multiple separate deposition and etching steps into a simplified deposition-only process. By combining the functions of pattern formation and conductor creation into a single deposition step, the overall fabrication process complexity is reduced while still achieving the required manufacturing precision for redistribution traces
2Manufacturing precision
If masks and specialized tools are used for fabricating redistribution traces, then manufacturing precision is improved, but equipment cost and production cost increase
Solution Approach 1:
The patent replaces expensive, reusable masks with a disposable or programmable deposition approach. By using direct deposition methods that can be controlled through software or programmed parameters rather than physical masks, the equipment cost and production cost are reduced while maintaining pattern accuracy through digital control
Solution Approach 2:
The patent substitutes the mechanical masking system with a digitally controlled deposition system. Instead of using physical masks that require alignment and handling, the invention uses programmable deposition controls to define trace patterns, reducing equipment complexity and cost while maintaining manufacturing precision through software-based pattern definition
3Manufacturing precision
If traditional fabrication methods are used for different electronic components, then manufacturing precision is maintained, but adaptability decreases due to requirement for new masks and tools
Solution Approach 1:
The patent creates a universal deposition-based fabrication method that can be applied to different electronic component types without requiring component-specific masks or tools. The programmable deposition system can be reconfigured through software to create different redistribution trace patterns for various component geometries and terminal arrangements, maintaining manufacturing precision across different applications while significantly improving adaptability
Solution Approach 2:
The patent introduces dynamic, programmable control to the deposition process, allowing the fabrication parameters and patterns to be changed flexibly for different component types. Instead of static masks that must be physically changed for each component variant, the invention uses dynamically adjustable deposition parameters and patterns that can be reconfigured through software, maintaining precision while enabling rapid adaptation to different component designs
4Manufacturing precision
If multiple deposition and etching steps are used, then redistribution trace quality is improved, but production time and waste generation increase
Solution Approach 1:
The patent extracts and removes the time-consuming etching steps from the fabrication process by using direct deposition methods. By forming conductive traces through deposition alone without subsequent etching, the fabrication throughput is improved while maintaining trace integrity through controlled deposition parameters and material selection
Solution Approach 2:
The patent performs preliminary pattern definition through deposition control rather than requiring subsequent etching steps. By pre-defining the exact trace patterns during the deposition process itself through programmed parameter control, the fabrication process is shortened and throughput is improved while ensuring trace quality is achieved during the deposition stage rather than through later etching operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the complexity and cost of fabricating redistribution traces by minimizing the number of deposition and etching steps, allowing for flexible and efficient production of redistribution traces with minimal waste, and enabling the use of 'soft' tools configured by software for various electronic components.
Implementation Method 1
Some embodiments of the invention can include the use of printing technology, such as ink printing technology, to deposit the droplets on an electronic component in selected patterns to form the redistribution traces
Data Source
AI summary
A probe substrate for use in testing semiconductor devices can include a base substrate that can have first electrical terminals at a first pitch. One or more redistribution layers on the base substrate can include droplets of a conductive material that form redistribution traces extending from the first terminals to second electrical terminals at a second pitch different from the first pitch.